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Ink-Jet Printed Copper Complex MOD Ink for Plastic Electronics
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2014 (English)In: International Conference on Non Impact Printing and Digital Fabrication, 2014, 191-193 p.Conference paper, Published paper (Refereed)
Abstract [en]

The development of highly conductive copper patterns on low-cost flexible substrates (PET, PEN, etc.) by inkjet printing is reported. Copper films were obtained from a metallo-organic decomposition (MOD) ink composed of a copper complex and suitable low-viscosity solvents. Upon heating the ink decomposed and was converted into metallic copper under nitrogen as inert atmosphere.Additionally samples were prepared using inkjet technology on various substrates. The required layer thickness for current conduction was assessed by printing on PET and sintering at 150 °C in a vacuum oven.

Place, publisher, year, edition, pages
2014. 191-193 p.
Series
NIP & Digital Fabrication Conference, ISSN 2169-4451
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-159665OAI: oai:DiVA.org:kth-159665DiVA: diva2:786635
Conference
International Conference on Non Impact Printing and Digital Fabrication, 2014
Note

QC 20150327

Available from: 2015-02-06 Created: 2015-02-06 Last updated: 2015-03-27Bibliographically approved

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http://www.ingentaconnect.com/content/ist/nipdf/2014/00002014/00000001/art00047

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Müller, MaikReinhold, IngoZapka, Werner
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