Inkjet Printing of Electrical Connections in Electronic Packaging
2011 (English)In: NIP27 : 27th International Conference on Digital Printing Technologies, October 2-6, 2011, Minneapolis, Minnesota ; Digital Fabrication 2011: technical programs and proceedings, The Society for Imaging Science and Technology, 2011, 445-451 p.Conference paper (Refereed)
Two aspects were evaluated of an approach to produce inkjet printed electrical connections in a roll-to-roll application. In the first part it was demonstrated that inkjet printing with silver nanoparticles allows to connect LED dies embedded in a flexible polymeric substrate by way of electrical via connections and to operate the LED dies at their nominal 20 mA and 3 V driving conditions. A standard convection oven process was used to sinter the inkjet printed tracks. The second part of the work focused on identifying sinter technologies that provide the required fast processing times needed for roll-to-roll applications. IR irradiation, Rapid Electrical Sintering, and Broadband Photonic Curing were evaluated and compared with Convective Oven Sintering as benchmark technique. All these techniques produced similar track conductivities. Fastest operation was obtained with Broadband Photonic Curing, which enabled a total process time of three seconds as compared with 150°C and 30 min in the convection oven.
Place, publisher, year, edition, pages
The Society for Imaging Science and Technology, 2011. 445-451 p.
Convection oven, Driving conditions, Electrical connection, Electronic Packaging, Flexible polymeric substrates, IR irradiation, Process time, Processing time, Roll to Roll, Silver nanoparticles
Other Engineering and Technologies
IdentifiersURN: urn:nbn:se:kth:diva-159655ScopusID: 2-s2.0-84860747196ISBN: 978-089208296-4OAI: oai:DiVA.org:kth-159655DiVA: diva2:786646
27th International Conference on Digital Printing Technologies, NIP27 and 7th International Conference on Digital Fabrication 2011, Minneapolis, MN, United States, 2 October 2011 through 6 October 2011
QC 201502062015-02-062015-02-062015-02-06Bibliographically approved