Soldering Connections for High Frequency Applications between Flexible and Rigid Printed Circuit boards
2006 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972, Vol. 29, no 1, 118-126 p.Article in journal (Refereed) Published
This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured.
Place, publisher, year, edition, pages
2006. Vol. 29, no 1, 118-126 p.
Backplane, connector, flex, FR4, high frequency, lead-free, soldering
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-5148DOI: 10.1109/TCAPT.2006.OAI: oai:DiVA.org:kth-5148DiVA: diva2:7947
Uppdaterad från submitted till published: 20101006
QC 201010062005-05-252005-05-252010-10-06Bibliographically approved