Change search
ReferencesLink to record
Permanent link

Direct link
RDesign of magnetic transceivers for 3-d integrated circuits
KTH, School of Engineering Sciences (SCI), Applied Physics, Nanostructure Physics.ORCID iD: 0000-0003-2339-1692
2014 (English)In: IEEE transactions on magnetics, ISSN 0018-9464, E-ISSN 1941-0069, Vol. 50, no 11, 6971254Article in journal (Refereed) Published
Abstract [en]

Use of magnetic film inductors as transceiver elements for wireless transfer of power and signal communication between vertically stacked silicon integrated circuits is discussed. Two characteristic designs are compared - a vertical magnetic core with high-aspect-ratio laminations and a planar magnetic core where flux closure is achieved by a suitable design of the interchip air gap. The latter design is argued to hold a promise for 3-D circuit integration.

Place, publisher, year, edition, pages
2014. Vol. 50, no 11, 6971254
Keyword [en]
3-D circuit integration, Integrated circuits (ICs), magnetic film inductors
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
URN: urn:nbn:se:kth:diva-161499DOI: 10.1109/TMAG.2014.2325132ISI: 000349465900499ScopusID: 2-s2.0-84916236844OAI: diva2:794832

QC 20150313

Available from: 2015-03-13 Created: 2015-03-12 Last updated: 2015-03-26Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus

Search in DiVA

By author/editor
Korenivski, Vladislav
By organisation
Nanostructure Physics
In the same journal
IEEE transactions on magnetics
Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

Altmetric score

Total: 42 hits
ReferencesLink to record
Permanent link

Direct link