New Solutions for High Frequency Electronic Packaging
2003 (English)In: 2003 IEEE International Symposium on Electromagnetic Compatibility (EMC), Vols 1 and 2, Symposium Record, 2003, 954-957 p.Conference paper (Refereed)
A new concept for shielded enclosures of electronics is presented in this paper. An inexpensive doubled heatsink in extruded aluminum forms the base of the enclosure. The electronics are inserted into one part and is enclosed by a complementary shielding surface. The outer heatsink is cooled by forced ventilation. As openings are made redundant, seams between the parts of the enclosure are the only path for significant electromagnetic emissions.
Place, publisher, year, edition, pages
2003. 954-957 p.
EMC, heat sink, enclosure, electronic, high frequency, shielding
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-5154DOI: 10.1109/ICSMC2.2003.1429069ISI: 000228094500248OAI: oai:DiVA.org:kth-5154DiVA: diva2:7953
IEEE International Symposium on Electromagnetic Compatibility (EMC) Istanbul, TURKEY, MAY 11-16, 2003
QC 20101006 2005-05-252005-05-252010-10-06Bibliographically approved