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Alternative electronic packaging concepts for high frequency electronics
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
2005 (English)Doctoral thesis, comprehensive summary (Other scientific)
Abstract [en]

The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. Besides this, an extensive knowledge of industrial engineering should be an essential part of this undertaking to improve electronic packaging. Customary advances in technology are driven by new findings and a continuous development of processes in clearly defined fields. However, in the field of the higher levels of the interconnection hierarchy, that is external to the chip level interconnections and chip packaging, it is supposed that a wide combination of disciplines and technical creativity, instead of advanced technology in a special area should produce most added value.

The thesis is divided into five areas, interlinked by the overall aim of there advantages to the common goal. These areas are the Printed Wiring Board (PWB) technology, PWB connections using flexible printed circuit boards, multiconductor cable connections, shielded enclosures and the related EMC issues, and finally the cooling of electronics. A central issue was to improve the shielded enclosures to be effective also at very high frequencies; it will be shown that shielded enclosures without apertures can cope with frequencies up to and above 15 GHz. Due to this enclosure without apertures, it was necessary to develop a novel cooling structure. This cooling structure consists of a heat sink where the PCB’s are inserted in close contact to the cooling fins on one side, whereas the other side of the heat sink is cooled by forced ventilation. The heat transfer between these parts is completely inside the same body. Tests carried out on a prototype have shown that the performance of the cooling structure is satisfactory for electronic cooling.

Another problem area that is addressed are the interconnect problems in high frequency applications. Interconnections between parts of a local electronic system, or as within the telecom and datacom field between subscribers, are commonly accomplished by cable connections. In this research work multiconductor cables are examined and a patented novel cable-connector for high frequency use is presented. Further, an experimental complex soldering method between flexible printed circuits boards and rigid printed circuits boards, as part of connections between PCBs, is shown. Finally, different sectors of the PCB technology for high frequency applications are scrutinized and measurements on microstrip structures are presented.

Place, publisher, year, edition, pages
Stockholm: KTH , 2005. , viii, 73 p.
Series
Trita-EKT, ISSN 1650-8599 ; 2005:3
Keyword [en]
Electrical engineering, Connector, cooling, electronic, elastomer interconnect, EMC, shielded enclosure, high frequency, PCB, PWB, reverberation chamber, seams, soldering, twisted pair cable
Keyword [sv]
Elektroteknik
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-223OAI: oai:DiVA.org:kth-223DiVA: diva2:7956
Public defence
2005-06-01, sal C1, KTH-Electrum, 13:15
Opponent
Supervisors
Note
QC 20101006Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2010-10-06Bibliographically approved
List of papers
1. Some Aspects on Signal In-tegrity Issues in High Frequency Printed Circuit Boards with Respect to Microstrip Transmission Lines
Open this publication in new window or tab >>Some Aspects on Signal In-tegrity Issues in High Frequency Printed Circuit Boards with Respect to Microstrip Transmission Lines
2005 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972Article in journal (Other academic) Submitted
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5146 (URN)
Note
QS 2010 QS 20120319Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-12-04Bibliographically approved
2. On the problem of using guard traces for high frequency differential lines crosstalk reduction
Open this publication in new window or tab >>On the problem of using guard traces for high frequency differential lines crosstalk reduction
2007 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972, Vol. 30, no 1, 67-74 p.Article in journal (Refereed) Published
Abstract [en]

In this paper, the problem of using guard traces for reducing crosstalk between differential transmission line pairs is investigated, both experimentally and by full-wave electromagnetic (EM) simulations. Different cases of differential lines crosstalk are treated with and without guard trace separation between the differential line pairs. Coated microstrip printed circuit board test structures including thru-reflect-line calibration standards are designed and fabricated on a high frequency laminate material, allowing direct measurement of crosstalk between adjacent differential line pairs in the absence and in the presence of guard traces stitched with vias of regular spacing. The test structures are characterized with mixed-mode scattering parameters using a physical layer test system. Different configurations (of differential line pairs) without guard trace, with floating guard traces (which are terminated and nonterminated) and with a solid guard trace separation are investigated using a High Frequency Structure Simulator (a commercial full-wave 3-D EM simulation tool). The experimental data are compared with the simulation results, and some conclusions and guidelines on the effect of guard traces for alleviating crosstalk between differential transmission lines are presented.

Keyword
coated microstrip differential transmission lines, coupling, guard trace, high frequency crosstalk, signal integrity, S-parameters measurement, thru-reflect-line (TRL) calibration
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5147 (URN)10.1109/TCAPT.2007.892072 (DOI)000245418400009 ()2-s2.0-34147122524 (Scopus ID)
Note

Tidigare titel: Differential lines Crosstalk Reduction Using Guard Traces Uppdaterad från submitted till published: 20101006 QC 20101006

Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-12-04Bibliographically approved
3. Soldering Connections for High Frequency Applications between Flexible and Rigid Printed Circuit boards
Open this publication in new window or tab >>Soldering Connections for High Frequency Applications between Flexible and Rigid Printed Circuit boards
2006 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972, Vol. 29, no 1, 118-126 p.Article in journal (Refereed) Published
Abstract [en]

This article examines the backplane connector technology for high frequency use and presents a novel concept for shielded enclosures without air vents. The experimental soldering of connections between a flexible printed circuit (flex, for short) and a FR4-board as part of a backplane connector is presented. A very high contact density is reached by soldering vias on the flex to pads on the FR4; this soldering was performed both with ordinary Sn/Pb solder material and as well with lead-free solder alloy. The solder joints were examined using a scanning electron microscope (SEM) and the electrical properties of the flex/solder joint structure were measured.

Keyword
Backplane, connector, flex, FR4, high frequency, lead-free, soldering
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5148 (URN)10.1109/TCAPT.2006. (DOI)
Note
Uppdaterad från submitted till published: 20101006 QC 20101006Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-12-04Bibliographically approved
4. High Frequency Cable Connector for Twisted Pair Cables
Open this publication in new window or tab >>High Frequency Cable Connector for Twisted Pair Cables
2006 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972, Vol. 26, no 3, 642-650 p.Article in journal (Refereed) Published
Abstract [en]

A new cable connector for twisted.,pair cable usable for high frequency applications is presented in this paper. An elastic conductive matrix as an interface between cable and printed wiring board (PWB) is pressed Against the ends of the copper wires of the cable, and a land grid array on the PWB; thereby making the connections. The shielding braid of the cable is lengthened by a tube structure up to,the same plane as the end of the copper wires, where the shielding is connected to an earth plane on the PWB. This not only gives a sound basis for good electromagnetic interfere (EMI) behavior, but can also serve as an adequate structure for a dc barrier of coin lion-mode currents in the shielding of twisted pair cables. A washer-formed capacitor between the earth of the PWB and the shielding tube structure would, probably be the only addition needed.

Keyword
elastomer interconnect, high frequency, MPI, signal connector, twisted pair cable
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5149 (URN)10.1109/TCAPT.2003.817656 (DOI)000185752200019 ()
Note
QC 20101006Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-12-04Bibliographically approved
5. Supplementary Examinations and Measurements on “"High Fre-quency Cable Connector for Twisted Pair Cables" and on Multiconductor Cables to be used in Connection with the Cable Connector
Open this publication in new window or tab >>Supplementary Examinations and Measurements on “"High Fre-quency Cable Connector for Twisted Pair Cables" and on Multiconductor Cables to be used in Connection with the Cable Connector
2005 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972Article in journal (Other academic) Submitted
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5150 (URN)
Note
QS 2010 QS 20120319Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-12-04Bibliographically approved
6. Cooling Structure for Electronics
Open this publication in new window or tab >>Cooling Structure for Electronics
2002 (English)In: ScandTherm First Scandinavian Conference on Thermal Management of Electronics, 2002, 14-19 p.Conference paper, Published paper (Refereed)
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5151 (URN)
Note
QC 20101006Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2010-10-06Bibliographically approved
7. Cooling Structure for EMC Shielded High Frequency Electronics
Open this publication in new window or tab >>Cooling Structure for EMC Shielded High Frequency Electronics
2006 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972, Vol. 29, no 1, 155-163 p.Article in journal (Refereed) Published
Abstract [en]

Cooling of electronics is normally achieved using air passing through apertures in the enclosure; as a result the shielding effectiveness of the shielded enclosure is reduced. In this paper, the design of a new cooling structure and its evaluation in a wind tunnel is presented.

The developed design presented here is a double heat sink in extruded aluminum. Into one side of the heat sink, the printed circuit boards (PCBs) are inserted and enclosed by a complementary shielding surface. The other side of the heat sink is cooled by forced ventilation. The heat transport between these parts is completely inside the same body, without any heat flow interruptions. Tests carried out on a prototype have shown that the performance of the cooling structure is satisfactory for electronic cooling. An additional electromagnetic compatibility (EMC)-test has also elucidated the satisfactory shielding effectiveness of the structure.

The cooling structure is scaleable and can accommodate for both future smaller printed circuit boards (PCBs) and those of today. The entire enclosure is furthermore based on near-standard items, which allows it to be inexpensive in high volume production.

Keyword
electronic, electromagnetic compatibility (EMC), heat sink, high frequency, shielding
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5152 (URN)10.1109/TCAPT.2005.853176 (DOI)000235900500019 ()
Note

Uppdaterad från submitted till published: 20101006 QC 20101006

Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-06-09Bibliographically approved
8. Methods for prediction of an optimised Cooling Structure for High Frequency Electronics
Open this publication in new window or tab >>Methods for prediction of an optimised Cooling Structure for High Frequency Electronics
2005 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972Article in journal (Other academic) Submitted
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5153 (URN)
Note
QS 2010 QS 20120319Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-12-04Bibliographically approved
9. New Solutions for High Frequency Electronic Packaging
Open this publication in new window or tab >>New Solutions for High Frequency Electronic Packaging
2003 (English)In: 2003 IEEE International Symposium on Electromagnetic Compatibility (EMC), Vols 1 and 2, Symposium Record, 2003, 954-957 p.Conference paper, Published paper (Refereed)
Abstract [en]

A new concept for shielded enclosures of electronics is presented in this paper. An inexpensive doubled heatsink in extruded aluminum forms the base of the enclosure. The electronics are inserted into one part and is enclosed by a complementary shielding surface. The outer heatsink is cooled by forced ventilation. As openings are made redundant, seams between the parts of the enclosure are the only path for significant electromagnetic emissions.

Keyword
EMC, heat sink, enclosure, electronic, high frequency, shielding
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5154 (URN)10.1109/ICSMC2.2003.1429069 (DOI)000228094500248 ()
Conference
IEEE International Symposium on Electromagnetic Compatibility (EMC) Istanbul, TURKEY, MAY 11-16, 2003
Note
QC 20101006 Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2010-10-06Bibliographically approved
10. EMC Considerations on Enclosures and New Solutions for High Frequency Electronic Packaging
Open this publication in new window or tab >>EMC Considerations on Enclosures and New Solutions for High Frequency Electronic Packaging
2005 (English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972Article in journal (Other academic) Submitted
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-5155 (URN)
Note
QS 2010 QS 20120319Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2017-12-04Bibliographically approved
11. High Frequency Measurements and Simulations on Seams of Enclosures
Open this publication in new window or tab >>High Frequency Measurements and Simulations on Seams of Enclosures
2004 (English)Manuscript (preprint) (Other academic)
Identifiers
urn:nbn:se:kth:diva-5156 (URN)
Note

QS 2015

Available from: 2005-05-25 Created: 2005-05-25 Last updated: 2015-06-26Bibliographically approved

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  • harvard1
  • ieee
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  • nn-NO
  • nn-NB
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Output format
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  • asciidoc
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