Development of Through Glass Vias (TGVs) for Interposer Applications
Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
In this thesis work the manufacturing of through glass vias (TGVs) is presented.
The TGVs were manufactured by adapting technique based on magnetic assembly
developed at KTH for creating through silicon vias (TSVs). TGVs were fabricated
by introducing nickel wires in via-holes that were pre-made on a glass substrate
and applying a spin-on polymer to isolate the nickel wires from the walls of the
Another focus of this work was improving the TGV and TSV manufacturing
process. This was done by investigating the inuence of the assembly speeds on
the yield of the assembly process. Two methods for removing the excess wires left
on the surface of the wafer after the magnetic assembly of the nickel wires were
tested. Also the inuence the pitch between the via-holes has on the yield of the
process was investigated.
Place, publisher, year, edition, pages
2014. , 40 p.
EES Examensarbete / Master Thesis, XR-EE-MST 2014:005
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-165618OAI: oai:DiVA.org:kth-165618DiVA: diva2:808700
Master of Science - Embedded Systems
Niklaus, Frank, Professor