Reaction injection molding and direct covalent bonding of OSTE+ polymer microfluidic devices
2015 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 25, no 7Article in journal (Refereed) Published
In this article, we present OSTE+RIM, a novel reaction injection molding (RIM) process that combines the merits of off-stoichiometric thiol–ene epoxy (OSTE+) thermosetting polymers with the fabrication of high quality microstructured parts. The process relies on the dual polymerization reactions of OSTE+ polymers, where the first curing step is used in OSTE+RIM for molding intermediately polymerized parts with well-defined shapes and reactive surface chemistries. In the facile back-end processing, the replicated parts are directly and covalently bonded and become fully polymerized using the second curing step, generating complete microfluidic devices. To achieve unprecedented rapid processing, high replication fidelity and low residual stress, OSTE+RIM uniquely incorporates temperature stabilization and shrinkage compensation of the OSTE+ polymerization during molding. Two different OSTE+ formulations were characterized and used for the OSTE+RIM fabrication of optically transparent, warp-free and natively hydrophilic microscopy glass slide format microfluidic demonstrator devices, featuring a storage modulus of 2.3 GPa and tolerating pressures of at least 4 bars.
Place, publisher, year, edition, pages
Institute of Physics (IOP), 2015. Vol. 25, no 7
off-stoichiometric thiol–ene, epoxy, OSTE+, reaction injection molding, device fabrication, polymers, microfluidics
IdentifiersURN: urn:nbn:se:kth:diva-165616DOI: 10.1088/0960-1317/25/7/075002OAI: oai:DiVA.org:kth-165616DiVA: diva2:808710
QC 2015006182015-04-292015-04-292015-06-18Bibliographically approved