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Special issue WaferBond'13 "International Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration"
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-0525-8647
2015 (English)In: Microsystem Technologies: Micro- and Nanosystems Information Storage and Processing Systems, ISSN 0946-7076, E-ISSN 1432-1858, Vol. 21, no 5, 951-951 p.Article in journal, Editorial material (Other academic) Published
Place, publisher, year, edition, pages
2015. Vol. 21, no 5, 951-951 p.
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Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:kth:diva-171680DOI: 10.1007/s00542-015-2462-2ISI: 000353296000001OAI: oai:DiVA.org:kth-171680DiVA: diva2:845681
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QC 20150812

Available from: 2015-08-12 Created: 2015-08-05 Last updated: 2017-12-04Bibliographically approved

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Niklaus, Frank

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