High Power Combiner/Divider Design for Dual Band RF Power Amplifiers
2015 (English)In: IEEE International Conference on Electromagnetics in Advanced Applications, IEEE conference proceedings, 2015, 1036-1039 p.Conference paper (Refereed)
Design of low loss with an enhanced thermal profile power divider/combiner for high power dual-band Radio Frequency (RF) power amplifier applications is given. The practical implementation, low loss and substrate characteristics make this type of combiner ideal for high power microwave applications. The combiner operational frequencies are chosen to operate at 900 MHz and 2.14 GHz, which are common frequencies for concurrent dual band RF power amplifiers. The analytical results are verified with simulation results for various cases and agreement has been observed on all of them.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2015. 1036-1039 p.
IdentifiersURN: urn:nbn:se:kth:diva-173368DOI: 10.1109/ICEAA.2015.7297272ISI: 000378428800197ScopusID: 2-s2.0-84955502943OAI: oai:DiVA.org:kth-173368DiVA: diva2:852841
IEEE International Conference on Electromagnetics in Advanced Applications,7-11 Sept. 2015, Turin
Qc 201512112015-09-102015-09-102016-08-09Bibliographically approved