Change search
ReferencesLink to record
Permanent link

Direct link
Chip-Package co design of high performance mixer for 5GHz WLAN with integrated passive components
KTH, School of Information and Communication Technology (ICT).
2015 (English)Independent thesis Advanced level (degree of Master (Two Years)), 20 credits / 30 HE creditsStudent thesis
Abstract [en]

A passive mixer is designed in a silicon germine process for use in a 5GHz WLAN receiver. The design is implemented as a fully on-chip design and copackage design with passive components integrated on the substrate in the package. Also for each implementation the performance is evaluated with twelve different bonding inductances, from 50pH to 2nH. To estimate connection parasitic floorplans have been made for normal wirebonding and solderbumps for each of the implementation. The performance parameters compared are conversion gain, noise close to signal, noise with high frequency offset to the signal and IIP3. Some performance differences can be found between different implementations but neither of the implementations can be consider superior to the other.

Place, publisher, year, edition, pages
TRITA-ICT-EX, 2015:40
URN: urn:nbn:se:kth:diva-174899OAI: diva2:859813
Available from: 2015-10-08 Created: 2015-10-08 Last updated: 2015-10-08Bibliographically approved

Open Access in DiVA

No full text

By organisation
School of Information and Communication Technology (ICT)

Search outside of DiVA

GoogleGoogle Scholar
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

ReferencesLink to record
Permanent link

Direct link