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RF Interconnections for Paper Electronics
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.ORCID iD: 0000-0002-0528-9371
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
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2015 (English)In: IEEE Microwave and Wireless Components Letters, ISSN 1531-1309, E-ISSN 1558-1764, Vol. 25, no 10, 684-686 p.Article in journal (Refereed) Published
Abstract [en]

Low temperature and the fragility features of paper substrate require novel approach for the heterogeneous integration of silicon chip and printed components. In this letter, RF interconnection via capacitive coupling is proposed for printed paper electronics. Capacitive coupling combined with the printed transmission line is used as the signal channel and realizes chip-to-chip communication. Modulation such as orthogonal frequency-division multiplexing is used for multiple chips to share the same transmission channel and increase the data rate. The channel response of the RF interconnection is studied and the feasibility is evaluated.

Place, publisher, year, edition, pages
2015. Vol. 25, no 10, 684-686 p.
Keyword [en]
Capacitive coupling, inkjet printing, paper electronics, RF interconnection
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-175916DOI: 10.1109/LMWC.2015.2468572ISI: 000362359100018Scopus ID: 2-s2.0-84961054007OAI: oai:DiVA.org:kth-175916DiVA: diva2:867052
Funder
VINNOVA
Note

QC 20151104

Available from: 2015-11-04 Created: 2015-10-26 Last updated: 2017-12-01Bibliographically approved

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Xie, Li

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VinnExcellence Center for Intelligence in Paper and Packaging, iPACKIndustrial and Medical Electronics
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Electrical Engineering, Electronic Engineering, Information Engineering

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