RF Interconnections for Paper Electronics
2015 (English)In: IEEE Microwave and Wireless Components Letters, ISSN 1531-1309, E-ISSN 1558-1764, Vol. 25, no 10, 684-686 p.Article in journal (Refereed) Published
Low temperature and the fragility features of paper substrate require novel approach for the heterogeneous integration of silicon chip and printed components. In this letter, RF interconnection via capacitive coupling is proposed for printed paper electronics. Capacitive coupling combined with the printed transmission line is used as the signal channel and realizes chip-to-chip communication. Modulation such as orthogonal frequency-division multiplexing is used for multiple chips to share the same transmission channel and increase the data rate. The channel response of the RF interconnection is studied and the feasibility is evaluated.
Place, publisher, year, edition, pages
2015. Vol. 25, no 10, 684-686 p.
Capacitive coupling, inkjet printing, paper electronics, RF interconnection
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-175916DOI: 10.1109/LMWC.2015.2468572ISI: 000362359100018ScopusID: 2-s2.0-84961054007OAI: oai:DiVA.org:kth-175916DiVA: diva2:867052
QC 201511042015-11-042015-10-262015-11-04Bibliographically approved