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Thermohydrodynamics of boiling in binary compressible fluids
KTH, School of Engineering Sciences (SCI), Mechanics, Physicochemical Fluid Mechanics.
KTH, School of Engineering Sciences (SCI), Mechanics, Physicochemical Fluid Mechanics.ORCID iD: 0000-0003-2830-0454
KTH, School of Engineering Sciences (SCI), Mechanics, Physicochemical Fluid Mechanics.ORCID iD: 0000-0003-3336-1462
2015 (English)In: Physical Review E. Statistical, Nonlinear, and Soft Matter Physics, ISSN 1539-3755, E-ISSN 1550-2376, Vol. 92, no 4, 043017Article in journal (Refereed) Published
Abstract [en]

We numerically study the thermohydrodynamics of boiling for a CO2 + ethanol mixture on lyophilic and lyophobic surfaces in both closed and open systems, based on a diffuse interface model for a two-component system. The corresponding wetting boundary conditions for an isothermal system are proposed and verified in this paper. New phenomena due to the addition of another component, mainly the preferential evaporation of the more volatile component, are observed. In the open system and the closed system, the physical process shows very different characteristics. In the open system, except for the movement of the contact line, the qualitative features are rather similar for lyophobic and lyophilic surfaces. In the closed system, the vortices that are observed on a lyophobic surface are not seen on a lyophilic surface. More sophisticated wetting boundary conditions for nonisothermal, two-component systems might need to be further developed, taking into account the variations of density, temperature, and surface tension near the wall, while numerical results show that the boundary conditions proposed here also work well even in boiling, where the temperature is nonuniform.

Place, publisher, year, edition, pages
AMER PHYSICAL SOC , 2015. Vol. 92, no 4, 043017
Keyword [en]
Lattice Boltzmann Simulation, Level Set Methods, Numerical-Simulation, Heat-Transfer, 2-Phase Flows, Bubble-Growth, Mixtures, Surface, Liquid, Volume
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Other Materials Engineering Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:kth:diva-176955DOI: 10.1103/PhysRevE.92.043017ISI: 000363301500007ScopusID: 2-s2.0-84946761833OAI: oai:DiVA.org:kth-176955DiVA: diva2:881835
Note

QC 20151211

Available from: 2015-12-11 Created: 2015-11-13 Last updated: 2015-12-11Bibliographically approved

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Liu, JieweiDo-Quang, MinhAmberg, Gustav
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