Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py-GC/MS)
2015 (English)In: Journal of Analytical and Applied Pyrolysis, ISSN 0165-2370, E-ISSN 1873-250X, Vol. 115, 337-343 p.Article in journal (Refereed) Published
The purpose of this study is to experimentally investigate the pyrolytic behavior of printed circuit boards (PCBs) waste fraction at a temperature range of 400 °C to 900 °C by means of thermogravimetric analysis (TGA) and analytical pyrolysis (Py-GC/MS) was carried out. The experimental results reveal that the chemical composition of the PCBs and the relatively high ash content (=79% w/w) are strongly connected with the high quantity of metals and ceramic materials. The main decomposition of PCBs occurs between 250 °C and 370 °C. The pyrolysis of PCBs showed a varying production of aromatic compounds such as phenol, bromophenol, styrene, methylstyrene, and bisphenol A as well as non-aromatic compounds such as acetone and bromomethane, which are strongly related with the initial chemical composition of PCBs. Moreover, Py-GC/MS revealed that temperature increase favours the production of aromatic hydrocarbons, while the phenol which is the most abundant compound produced, shows an opposite trend, as a result of its further decomposition to simpler products. Furthermore, brominated compounds produced, such as bromomethane and bromophenol, are derived from the flame retardant used during the manufacturing process and in that case the Py-GC/MS showed a slight decrease of brominated compounds with increase in temperature.
Place, publisher, year, edition, pages
Elsevier, 2015. Vol. 115, 337-343 p.
e-Waste, PCBs, Printed circuit boards, Py-GC/MS, Pyrolysis, TGA, Acetone, Aromatic compounds, Aromatic hydrocarbons, Aromatization, Bromine compounds, Ceramic materials, Chemical analysis, Chemical compounds, Cracking (chemical), Decomposition, Phenols, Printed circuits, Styrene, Thermogravimetric analysis, Analytical pyrolysis, Chemical compositions, E-wastes, Manufacturing process, Printed circuit board (PCBs)
IdentifiersURN: urn:nbn:se:kth:diva-175080DOI: 10.1016/j.jaap.2015.08.012ISI: 000362610300038ScopusID: 2-s2.0-84942296049OAI: oai:DiVA.org:kth-175080DiVA: diva2:881895
FunderSwedish Energy Agency, 36880-1
QC 201512112015-12-112015-10-092015-12-11Bibliographically approved