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Modeling of stresses and deformation in thin film and interconnect line structures
KTH, Superseded Departments, Solid Mechanics.
2001 (English)Doctoral thesis, comprehensive summary (Other scientific)
Place, publisher, year, edition, pages
Stockholm: Hållfasthetslära , 2001. , 14 p.
Trita-HFL, ISSN 1104-6813 ; 0294
Keyword [en]
Thin films, thermal stress, theory and modeling, interconnect lines, finite element, texture, copper, unpassivated lines, passivated lines
URN: urn:nbn:se:kth:diva-3224ISBN: OAI: diva2:9003
Public defence
NR 20140805Available from: 2001-10-05 Created: 2001-10-05Bibliographically approved

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