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System-in-package synthesizer for PCS/DCS application
Infineon Technology Nordic AB, Kista, Sweden.
2007 (English)In: European Microwave Week 2007 Conference Proceedings, IEEE , 2007, 520-523 p.Conference paper, Published paper (Refereed)
Abstract [en]

The article presents a system-in-package (SiP) approach for synthesizer system module used in frequency down-and up-conversion of PCS/DCS radio base station applications using low-temperature co-fired ceramic (LTCC). The hybrid module benefits from the latest qualified production technology based on multilayer LTCC technology. LTCC permits a relatively high level of circuit integration in which different parts of the synthesizer such as the VCO, buffer amplifier, loop filter, PLL circuit, switch, and voltage regulator are integrated in a single substrate of 21 x 16 x 4 mm3. The module exhibits minimum RF tuning sections, improved performance repeatability, excellent RF performance, and good low phase noise. The module covers 1800 MHz Rx/Tx and 1900 MHz Rx/Tx frequency bands. Adoption of the synthesizer to upper or lower frequency band is possible by means of few component changes in a novel tuneable resonator structure. The module's design concept defines 4 commercial products which is included in Infineon's portfolio of wireless infrastructure circuit solutions for PCS/DCS radio basestation applications.

Place, publisher, year, edition, pages
IEEE , 2007. 520-523 p.
National Category
Communication Systems
Identifiers
URN: urn:nbn:se:kth:diva-183065DOI: 10.1109/EMICC.2007.4412764Scopus ID: 2-s2.0-48149094596OAI: oai:DiVA.org:kth-183065DiVA: diva2:907110
Conference
Microwave Integrated Circuit Conference, 2007. EuMIC 2007. European
Note

QC 20160310

Available from: 2016-02-26 Created: 2016-02-26 Last updated: 2016-03-10Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
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Language
  • de-DE
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  • Other locale
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Output format
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