A novel high-level fault model to accelerate test process of on-chip communication structures for SoCs is proposed. To this end, bus components are modeled using a simple, yet efficient, graph-based technique and all possible faults on the graph nodes are probed. The proposed method is optimized in terms of test time. The method applies the same test process to all interconnects and components. Compared to the conventional stuck-at fault testing methods, our extensive simulations on the AMBA-AHB bus architecture reveal that our test method can help in achieving a significant test speed improvement. © 2015 IEEE.