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High-density chipless RFID tag for temperature sensing
KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. University of Engineering and Technology (UET).
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2016 (English)In: Electronics Letters, ISSN 0013-5194, E-ISSN 1350-911X, Vol. 52, no 8, 620-621 p.Article in journal (Refereed) Published
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Abstract [en]

A 30 bit high-density circular chipless RF identification tag based on C-shaped open end polarisation independent slots is presented. The encoding capacity of this design is enhanced in a compact size. Patch diameter of the tag is 24 mm. Circularly polarised incident plane waves are used for excitation. Data capacity of 30 bits is achieved in the frequency band of 3.1-11.7 GHz. Spectral signature-based radar cross- section results are also measured for flexible and temperature sensor integrated design. The prototype is inkjet printed on Kapton (R) HN heat resistant conformal sheet.

Place, publisher, year, edition, pages
INST ENGINEERING TECHNOLOGY-IET , 2016. Vol. 52, no 8, 620-621 p.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-186616DOI: 10.1049/el.2015.4488ISI: 000373950500027Scopus ID: 2-s2.0-84964788319OAI: oai:DiVA.org:kth-186616DiVA: diva2:932314
Funder
VINNOVA
Note

QC 20160601

Available from: 2016-06-01 Created: 2016-05-13 Last updated: 2016-06-01Bibliographically approved

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Amin, Yasar
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VinnExcellence Center for Intelligence in Paper and Packaging, iPACK
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Citation style
  • apa
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  • de-DE
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  • Other locale
More languages
Output format
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  • asciidoc
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