Metal Covered Elastic Micro-Bump Contacts as an Alternative to Commercial Elastic Interconnection Techniques
(English)In: IEEE transactions on components and packaging technologies (Print), ISSN 1521-3331, E-ISSN 1557-9972Article in journal (Other academic) Submitted
In this work, a novel chip-to-board interconnection structure have been manufactured, and some of its characteristics have been investigated. This chip connection technique can for instance serve as a FCOB (Flip Chip on Board) technique, for connecting test equipments during testing bare chip on wafer, and with some more development, in three dimensional multi chip modules. A setup of elastic micro-bumps was cast, metal covered, patterned, and electro-mechanically characterized. The metal-covered silicon elastomer contact-structures were manufactured on FR-4 carrier-plates. Visual inspection of the micro-bumps was conducted in a SEM (Scanning Electron Microscope). The electro-mechanical properties were measured by simultaneous use of a DMA (Dynamic Mechanical Analyzer) and a Kelvin Bridge structure for resistance measurement. The measurements gave the micro-bump to chip resistance behavior as a function of the micro-bump deflection distance and applied mechanical force when direct current was applied. The results obtained from the measurements have revealed that such a technique requires less than one tenth of the mechanical contact force for achieving the contact resistance of the same magnitude as for commercial elastic interconnection techniques. This would be of significant advantage because the amount of electrical contacts per unit of area has tendency of continued growth.
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-5459OAI: oai:DiVA.org:kth-5459DiVA: diva2:9832
QS 201203262006-03-142006-03-142012-03-26Bibliographically approved