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Very High Density Interconnect Elastomer Chip Sockets
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
2006 (English)In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 29, no 2, 202-210 p.Article in journal (Refereed) Published
Abstract [en]

The integration of more and more functionality into smaller and smaller form factor electronic products, drives the need for denser chip to substrate interconnect systems. As the number of I/O pins increases, the use of area array chips or packages becomes inevitable. Metal patterned elastomer chip sockets have now been improved to work with contact densities as high as 80000 contacts/cm(2) corresponding to a pitch of 36 mu m. Sockets with 10000 contacts and a 72-mu m pitch have survived more than 400 cycles in air-to-air thermal cycling chambers as well as freezing shocks caused by dipping into liquid nitrogen. Although the daisy chain test circuits breaks for temperatures lower than -50 degrees C and higher than 90 degrees C, they always return to the initial resistance values when entering the normal temperature range. The combination of a gold-to-gold contact interface and the elastic features of the contact bumps makes this socket an ideal compliance layer between bare chips and different types of carrier substrates, reducing the problems caused by thermomechanical mismatch between the substrate and the chip. Bad dies can easily be replaced, since the chip is not soldered or glued to the socket. The size and the possibility to control the geometry of the contacts provides means to maintain a good high-frequency characteristic impedance matching all the way to the chip pad.

Place, publisher, year, edition, pages
2006. Vol. 29, no 2, 202-210 p.
Keyword [en]
chip-first, chip socket, flip-chip, high-density interconnect, multichip modules, packaging, silicone elastomer, thermal fatigue, thermal stress
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-5462DOI: 10.1109/TADVP.2006.871178ISI: 000237429900001Scopus ID: 2-s2.0-33646534157OAI: oai:DiVA.org:kth-5462DiVA: diva2:9835
Note
QC 20110114Available from: 2006-03-14 Created: 2006-03-14 Last updated: 2017-11-21Bibliographically approved
In thesis
1. Manufacture and characterization of elastic interconnection microstructures in silicone elastomer
Open this publication in new window or tab >>Manufacture and characterization of elastic interconnection microstructures in silicone elastomer
2006 (English)Doctoral thesis, comprehensive summary (Other scientific)
Abstract [en]

The subject of this thesis is a new chip to substrate interconnection technique using self-aligning elastic chip sockets. This work was focused on the technology steps which are necessary to fulfill in order to realize the suggested technique. Elastic chip sockets offer a solution for several assembly and packaging challenges, such a thermo-mechanical mismatch, effortless rework, environmental compatibility, high interconnection density, high frequency signal integrity, etc.

Two of the most challenging technology aspects, metallization and etching of the silicone elastomer were studied, but also, air bubble free casting of the silicone elastomer was taken into consideration. Elastic chip sockets and single elastic micro-bump contacts of different shapes and sizes were manufactured and characterized.

The contact resistance measurements revealed that the elastic micro-bump contacts manufactured by using the developed methods require less than one tenth of the contact force to achieve the same low contact resistance as compared to commercial elastic interconnection structures.

The analysis and measurements of the high frequency properties of the elastic micro-bump structures have shown that they can operate up to several tens of GHz without a serious degradation of the signal quality.

The same methods were applied to manufacture very high density contact area array (approximately 80000 connections/cm2), which until now was achieved only using so called chip-first techniques.

The low contact resistance, the absence of environmentally harmful materials, no need of soldering, easy rework as well as capability of very high interconnecting density and very high frequency compatibility, indicates a high potential of this technique for assembly and packaging.

Moreover, the presented technology of the silicone elastomer micromachining (metallization and RIE in particular) can be used for manufacturing of other microstructures, like chemical or biological micro reactors.

Place, publisher, year, edition, pages
Stockholm: KTH, 2006. xiv, 47 p.
Series
Trita-EKT, ISSN 1650-8599 ; 2006:1
Keyword
silicone elastomer, packaging, assembly, elastic interconnection, chip socket, metallization, RIE of silicone elastomer
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-3877 (URN)
Public defence
2006-03-23, Sal Q221, Mittuniversitet, Östersund, 13:00
Opponent
Supervisors
Note
QC 20110114Available from: 2006-03-14 Created: 2006-03-14 Last updated: 2011-01-14Bibliographically approved

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