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  • 1.
    Bonnaud, Etienne L.
    KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.).
    Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations2011In: Journal of Electronic Packaging, ISSN 1043-7398, E-ISSN 1528-9044, Vol. 133, no 4, p. 041013-Article in journal (Refereed)
    Abstract [en]

    Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards to the observed complex material behavior, the nonlinear mixed hardening Armstrong and Frederick model combined with the Perzyna viscoplastic law was chosen to fit the experimental data. This model was subsequently implemented into a commercial finite element code and used to simulate drop tests. Actual drop test experiments were conducted in parallel and experimental results were compared to simulations. Prediction discrepancies were analyzed and explanations suggested.

  • 2.
    Jonsson, Hans
    et al.
    KTH, Superseded Departments, Energy Technology.
    Moshfegh, B
    Modeling and characterisation of plate fin heat sinks under bypass flow conditions using computational fluid dynamics methods2001In: Journal of Electronic Packaging, ISSN 1043-7398, E-ISSN 1528-9044Article in journal (Other academic)
  • 3. Martinez-Galvan, Eduardo
    et al.
    Carlos Ramos, Juan
    Anton, Raul
    Khodabandeh, Rahmatollah
    KTH, School of Industrial Engineering and Management (ITM), Energy Technology, Applied Thermodynamics and Refrigeration.
    Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a2011In: Journal of Electronic Packaging, ISSN 1043-7398, E-ISSN 1528-9044, Vol. 133, no 1, p. 011002-Article in journal (Refereed)
    Abstract [en]

    Experimental measurements in a spray cooling test rig have been carried out for several heat fluxes in the heater and different spray volumetric fluxes with the dielectric refrigerant R134a. Results of the heat transfer and the sprayed refrigerant film thickness measurements are presented. The film thickness measurements have been made with a high speed camera equipped with a long distance microscope. It has been found that there is a relation between the variation in the average Nusselt number and the film thickness along the spray cooling boiling curve. The heat transfer regimes along that curve are related not only with a variation in the average Nusselt number but also with changes in the film thickness. The qualitative analysis of those variations has served to understand better the heat transfer mechanisms occurring during the spray cooling.

  • 4.
    Palm, Björn E.
    et al.
    KTH, Superseded Departments, Energy Technology.
    Khodabandeh, Rahmatollah
    KTH, Superseded Departments, Energy Technology.
    Choosing working fluid for two-phase thermosyphon systems for cooling of electronics2003In: Journal of Electronic Packaging, ISSN 1043-7398, E-ISSN 1528-9044, Vol. 125, no 2, p. 276-281Article in journal (Refereed)
    Abstract [en]

    The heat fluxes from electronic components are steadily increasing and have now, in some applications, reached levels where air-cooling is no longer sufficient. One alternative solution, which has received much attention during the last decade, is to use heat pipes or thermosyphons for transferring or spreading the dissipated heat. In this paper two-phase thermosyphon loops are discussed. Especially, the choice of fluid and its influence on the design and performance is treated. The discussion is supported by results from simulations concerning heat transfer and pressure drop. In general it is found that high-pressure fluids will give better performance and more compact designs as high-pressure results in higher boiling heat transfer coefficients and smaller necessary tube diameter.

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