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  • 1.
    Linnarsson, Margareta K.
    et al.
    KTH, School of Engineering Sciences (SCI), Applied Physics, Material Physics, MF.
    Hallén, Anders
    KTH, School of Information and Communication Technology (ICT), Electronics, Integrated devices and circuits.
    Khartsev, Sergiy
    KTH, School of Information and Communication Technology (ICT), Electronics, Integrated devices and circuits.
    Suvanam, Sethu Saveda
    KTH, School of Information and Communication Technology (ICT).
    Usman, Muhammad
    KTH, School of Information and Communication Technology (ICT), Electronics, Integrated devices and circuits.
    Interface between Al2O3 and 4H-SiC investigated by time-of-flight medium energy ion scattering2017In: Journal of Physics D: Applied Physics, ISSN 0022-3727, E-ISSN 1361-6463, Vol. 50, no 49, article id 495111Article in journal (Refereed)
    Abstract [en]

    The formation of interfacial oxides during heat treatment of dielectric films on 4H-SiC has been studied. The 4H-SiC surface has been carefully prepared to create a clean and abrupt interface to Al2O3. An amorphous, 3 nm thick, Al2O3 film has been prepared on 4H-SiC by atomic layer deposition and rapid thermal annealing was then performed in N2O ambient at 700 degrees C and 1100 degrees C during 1 min. The samples were studied by time-of-flight medium energy ion scattering (ToF-MEIS), with sub-nanometer depth resolution and it is seen that, at both annealing temperatures, a thin SiOx (1 <= x <= 2) is formed at the interface. Our results further indicate that carbon remains in the silicon oxide in samples annealed at 700 degrees C. Additional electrical capacitance voltage measurements indicate that a large concentration of interface traps is formed at this temperature. After 1100 degrees C annealing, both MEIS and XRD measurements show that these features disappear, in accordance with electrical data.

  • 2.
    Usman, Muhammad
    et al.
    KTH, School of Electrical Engineering and Computer Science (EECS), Electronics, Integrated devices and circuits.
    Arshad, Muhammad
    Suvanam, Sethu Saveda
    KTH, School of Electrical Engineering and Computer Science (EECS).
    Hallen, Anders
    Influence of annealing environment on the ALD-Al2O3/4H-SiC interface studied through XPS2018In: Journal of Physics D: Applied Physics, ISSN 0022-3727, E-ISSN 1361-6463, Vol. 51, no 10, article id 105111Article in journal (Refereed)
    Abstract [en]

    The instability of Al2O3/4H-SiC interface at various process temperatures and ambient is investigated by the annealing of Al2O3/4H-SiC in low vacuum conditions as well as in N-2 environments. Atomic layer deposited Al2O3 on a 4H-SiC substrate with 3, 6 and 10 nm of thicknesses is treated at 300, 500, 700 and 900 degrees C under the vacuum level of 10(-1) torr. The as-deposited and annealed structures are analyzed using x-ray photoelectron spectroscopy. It is hypothesized that the minute quantity of oxygen present in low vacuum conditions diffuses through thin layers of Al2O3 and helps in forming SiO2 at the interface even at low temperatures (i.e. 300 degrees C), which plays a pivotal role in determining the electrical properties of the interface. It is also proved that the absence of oxygen in the ambient prevents the formation of SiO2 at low temperatures. Additionally, it is observed that Al-OH is present in as-deposited layers, which gradually reduces after annealing. However, at around 700 degrees C, the concentration of oxygen in the whole structure increases to maximum and reduces at 900 degrees C.

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