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  • 1.
    Cheng, Jie
    et al.
    KTH, School of Engineering Sciences in Chemistry, Biotechnology and Health (CBH), Chemistry, Surface and Corrosion Science. Tsinghua University, Beijing, China.
    Pan, J.
    Wang, T.
    Lu, X.
    Micro-galvanic corrosion of Cu/Ru couple in potassium periodate (KIO4) solution2018In: Corrosion Science, ISSN 0010-938X, E-ISSN 1879-0496, Vol. 137, p. 184-193Article in journal (Refereed)
    Abstract [en]

    This paper focuses on the study of micro-galvanic corrosion of the Cu/Ru couple in KIO4 solution. Practical nobility across the Cu/Ru interface was evaluated by Volta potential mapping, and the morphological changes were monitored by in-situ atomic force microscopy measurements during exposure in a KIO4 solution. Chemical composition of precipitated corrosion product was analyzed by Confocal Raman spectroscopy immediately after the exposure. The results show that Cu is the anode of the Cu/Ru couple, and accelerated dissolution of Cu preferentially occurs near the Cu/Ru interface. However, subsequent formation of insoluble Cu(IO3)2·nH2O leads to precipitation, which impedes further Cu corrosion.

  • 2.
    Cheng, Jie
    et al.
    KTH, School of Chemical Science and Engineering (CHE), Chemistry, Surface and Corrosion Science. Tsinghua University, China.
    Pan, Jinshan
    KTH, School of Chemical Science and Engineering (CHE), Chemistry, Surface and Corrosion Science.
    Lu, X.
    Micro-galvanic corrosion of cu-ru couple in potassium periodate (KIO4) solution2015In: European Corrosion Congress, EUROCORR 2015, Austrian Society for Metallurgy and Materials (ASMET) , 2015, Vol. 3, p. 1829-1829Conference paper (Refereed)
  • 3.
    Cheng, Jie
    et al.
    KTH, School of Chemical Science and Engineering (CHE), Chemistry, Surface and Corrosion Science.
    Wang, Tongqing
    Pan, Jinshan
    KTH, School of Chemical Science and Engineering (CHE), Chemistry, Surface and Corrosion Science.
    Lu, Xinchun
    Corrosion Investigations of Ruthenium in Potassium Periodate Solutions Relevant for Chemical Mechanical Polishing2016In: Journal of Electronic Materials, ISSN 0361-5235, E-ISSN 1543-186X, Vol. 45, no 8, p. 4067-4075Article in journal (Refereed)
    Abstract [en]

    Ruthenium is the most promising material for the barrier layer used for the sub 14 nm technology node in integrated circuits manufacturing. Potassium periodate (KIO4)-based slurry is used in the chemical mechanical planarization (CMP) process of the barrier layer. However, the electrochemical and corrosion properties of ruthenium have not been investigated in such slurry. In this paper, the electrochemical and corrosion behaviors of ruthenium in KIO4 solutions were investigated under static conditions but at different pH values by potentiodynamic polarization and electrochemical impedance spectroscopy measurements, combined with surface chemical analysis using auger electron spectroscopy. Moreover, to study wear enhanced corrosion during CMP, tribocorrosion experiments were carried out to monitor the current density changes during and after mechanical scratching. The results show that at pH 6, ruthenium forms a relatively thick and heterogeneous surface film composed of RuO2 center dot 2H(2)O/RuO3, showing a high corrosion resistance and it exhibits a quick repassivation after mechanical scratching. At pH 4, ruthenium shows a passivation behavior with formation of a uniform and conductive oxide like RuO2 center dot 2H(2)O. It should be noted that there is a possible formation of RuO4 toxic gas under this condition, which should be avoided in the actual production. However, at pH 11, ruthenium exhibits no considerable passivity and the corrosion proceeds uniformly.

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