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  • 1.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Decoupling capacitance for the power integrity of 3D-DRAM-over-logic system2012In: IEEE 13th Electronics Packaging Technology Conference (EPTC), 2011, IEEE conference proceedings, 2012, p. 590-594Conference paper (Refereed)
    Abstract [en]

    The 3D-DRAM stacked over the processor is a vibrant technique in order to overcome the memory wall as well as the bandwidth wall problems. We considered a system with two DRAM dies over a single processor die. We assumed the decoupling capacitors to be placed on each DRAM die and connected to the power distribution TSV pairs, where the TSVs pass through the DRAM stack. In this paper we proposed a mathematical model for the optimum value of the decoupling capacitance on each DRAM die along with the optimum values of the effective resistance of the interconnecting power distribution TSV pairs in order to ensure the power integrity of the logic load during switching. The proposed model has a maximum of 1.1% error as compared to the Ansoft Nexxim4.1.

  • 2.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Modeling of peak-to-peak core switching noise, output impedance, and decoupling capacitance along a vertical chain of power distribution TSV pairs2012In: Analog Integrated Circuits and Signal Processing, ISSN 0925-1030, E-ISSN 1573-1979, Vol. 73, no 1, p. 311-328Article in journal (Refereed)
    Abstract [en]

    In this article we propose an efficient and accurate model to estimate peak-to-peak core switching noise, caused by simultaneous switching of logic loads along a vertical chain of power distribution TSV pairs in a 3D stack of dies interconnected through TSVs. The proposed model is accurate with only a 2–3% difference in peak-to-peak core switching noise as compared to the Ansoft Nexxim4.1 equivalent model. The proposed model is 3–4 times faster than Ansoft Nexxim4.1 and uses two times less memory as compared to the Ansoft Nexxim4.1 equivalent model. In this article we also thoroughly establish design guidelines for almost flat output impedance magnitude at each stage of a vertical chain of power distribution TSV pairs to realize a resonance free scenario over a wide operating frequency range. We also establish decoupling capacitance design guidelines based on the optimum output impedance and critically damped supply voltage for the core logic for each stage of a vertical chain of power distribution TSV pairs.

  • 3.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Modeling of peak-to-peak switching noise along a vertical chain of power distribution TSV pairs in a 3D stack of ICs interconnected through TSVs2010In: 28th Norchip Conference, NORCHIP 2010, 2010, article id 5669473Conference paper (Refereed)
    Abstract [en]

    On-chip power supply noise has become a bottleneck in 3D ICs as scaling of the supply network impedance has not been kept up with increasing device densities and operating currents with each technology node due to limited wire resources. In this paper we proposed an efficient and accurate model to estimate peak-to-peak switching noise, caused by simultaneous switching of logic loads along a vertical chain of power distribution TSV pairs in a 3D stack of ICs. The proposed model is quite accurate with only 2-3% difference from Ansoft Nexxim4.1 equivalent model. The proposed model is 3-4 times faster than Nexxim4.1 as well as consumes two times less memory as compared to Nexxim4.1equivalent model. We analyzed peak-to-peak switching noise along a vertical chain of power distribution TSV pairs by varying physical dimensions of TSVs and value of decoupling capacitance. We also thoroughly investigated the peak-to-peak noise sensitivity to TSV effective inductance and decoupling capacitance.

  • 4.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair2010In: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, Institute of Electrical and Electronics Engineers (IEEE), 2010, p. 173-176, article id 5642574Conference paper (Refereed)
    Abstract [en]

    How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.

  • 5.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Kanth, Rajeev Kumar
    Turku Centre for Computer Science .
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Fast Transient Simulation Algorithm for a 3D Power distribution Bus2010In: Proceedings of IEEE Asia Symposium on Quality Electronic Design, 2010, p. 343-350Conference paper (Refereed)
    Abstract [en]

    Extensive transient simulations for on-chip power delivery networks are required to analyze power delivery fluctuations caused by dynamic IR and Ldi/dt drops. Speed and memory has become a bottleneck for simulation of power distribution networks in modern VLSI design where clock frequency is of the order of GHz. The traditional SPICE based tools are very slow and consume a lot of memory during simulation. The problem is further aggravated for huge networks like power distribution network within a stack of ICs inter-connected through TSVs. This type of 3D power distribution network may contain billions of nodes at a time. In this paper we proposed a faster transient simulation algorithm using visual C++. First we reduce 3D power distribution bus containing n nodes to a two terminal 7 network. Then we solve this two terminal reduced network for voltages and currents. After this, we apply back solving algorithm to the network to solve it for each of the intermediate nodes using visual C++. The proposed algorithm is quite accurate with 1-2% error when compared with Ansoft Nexxim4.1. The proposed algorithm is several times faster than Ansoft Nexxim as well as consumes significantly less memory as compared to Nexxim.

  • 6.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Kanth, Rajeev Kumar
    Turku Centre for Computer Science .
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Power distribution TSVs induced core switching noise2011In: Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2010 IEEE, IEEE conference proceedings, 2011Conference paper (Refereed)
    Abstract [en]

    Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip inductance and skin effect are prime players at frequencies of the order of GHz. The problem is further aggravated when chips are interconnected through TSVs to form a 3D integrated stack in order to achieve low form factor and high integration density. In this paper we analysed peak core switching noise in a 3D stack of integrated chips interconnected through power distribution TSV pairs, through our comprehensive mathematical model which has been proved to be quite accurate as compared to SPICE. We analysed the effect of number of chips in a 3D stack, rise time, decoupling capacitance, and skin effect on power distribution TSVs induced core switching noise in this paper.

  • 7.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Peak-to-Peak Ground Noise on a Power Distribution TSV Pair as a Function of Rise Time in 3-D Stack of Dies Interconnected Through TSVs2011In: IEEE Transactions on Components Packaging and Manufacturing Technology, ISSN 2156-3950, Vol. 1, no 2, p. 196-207Article in journal (Refereed)
    Abstract [en]

    Supply grids of integrated chips are interconnected through through-silicon vias (TSVs) in modern design techniques to form a 3-D stack in vertical direction. The load on each chip is supplied through (power/ground) TSV pairs. Accurate estimation of power/ground noise on each TSV pair of a 3-D power distribution network is necessary for a robust power supply design. The worst case noise obtained with fast switching characteristics may not be significantly accurate. The behavior of power/ground noise as a function of rise time for an inductive power distribution TSV pair with decoupling capacitance, is investigated in this paper. An equivalent rise time corresponding to resonance is presented to accurately estimate the worst case power/ground noise in the time domain. In addition noise sensitivity to decoupling capacitance and TSV inductance is evaluated as a function of rise time. We also discuss noise accumulation as a result of worst case damping factor in this paper.

  • 8.
    Ahmad, Waqar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Weerasekera, Roshan
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Weldezion, Awet Yemane
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Power Integrity Optimization of 3D Chips Stacked Through TSVs2009In: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, NEW YORK: IEEE , 2009, p. 105-108Conference paper (Refereed)
    Abstract [en]

    On-chip power distribution network model for simultaneous switching of 3D ICs stacked through TSVs to choose TSV pattern, maximum number of chips in a stack and location of the decoupling capacitor for early design trade-offs.

  • 9.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Shao, Botao
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Hållstedt, Julius
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Design and Analysis of Efficient and Compact Antenna for Paper Based UHF RFID Tags2008In: ISAPE 2008: THE 8TH INTERNATIONAL SYMPOSIUM ON ANTENNAS, PROPAGATION AND EM THEORY, PROCEEDINGS, VOLS 1-3 / [ed] Su D; Yan Z, NEW YORK: IEEE , 2008, p. 62-65Conference paper (Refereed)
    Abstract [en]

    Paper substrate is one of the paramount nominees for Radio Frequency Identification (RFID) tags but at the same time it is extremely prone towards environmental changes. In this paper, antennas for UHF RFID tags on paper based substrate are investigated and analyzed for the first time to evaluate the effect of change in dielectric constant on the antenna parameters and performance. On the basis of analysis a concrete meander line antenna is proposed, designed and evaluated which has tremendous immunity towards variation in dielectric constant.

  • 10.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Evolutionary Versatile Printable RFID Antennas For "Green" Electronics2012In: Journal Electromagnetic Waves and Applications, ISSN 0920-5071, E-ISSN 1569-3937, Vol. 26, no 2-3, p. 264-273Article in journal (Refereed)
    Abstract [en]

    The development of low cost directly printable RFID tag antennas is essential for item level tracking. We present evolutionary design approach to achieve robust extremely versatile RFID antennas on paper/flexible substrates which allow a simple integration directly on, e.g., paperboard in a roll-to-roll production line. Fully integrated printed tags for "green" electronics are designed for operability in frequencies 866-868 MHz & 902-928 MHz. We present benchmarking results for various challenges of antennas in terms of ruggedness, reliability and flexing performance.

  • 11.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Performance-Optimized Quadrate Bowtie RFID Antennas For Cost-Effective and Eco-Friendly Industrial Applications2012In: Progress in Electromagnetics Research-PIER, ISSN 1559-8985, Vol. 126, p. 49-64Article in journal (Refereed)
    Abstract [en]

    Fully integrated printed RFID antennas show potential solution for item level labeling applications. In order to accommodate the antenna during the package printing process, it is vastly preferred that antenna structures are printed on paper substrates. However, the electromagnetic properties and thickness of paper substrates are susceptible to change due to various environmental effects. Thus, adequately consistent in performance and material insensitive printed Quadrate Bowtie RFID antennas are proposed. This paper presents an in-depth efficient optimization for high performance tag antenna designs for operability in frequencies 866-868MHz & 902-928MHz. It is demonstrated that the proposed antennas can tolerate a considerable variation in the permittivity on thin paper substrates, and present benchmarking results when n across metal and water containing objects.

  • 12.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Design and Fabrication of Wideband Archimedean Spiral Antenna Based Ultra-Low Cost "Green" Modules for RFID Sensing and Wireless Applications2012In: Progress In Electromagnetics Research-PIER, ISSN 1559-8985, Vol. 130, p. 241-256Article in journal (Refereed)
    Abstract [en]

    A parametric analysis is performed for a wideband Archimedean spiral antenna in recognition of an emerging concept to integrate RFID along with several applications by using a single antenna. The antenna is fabricated using state-of-the-art inkjet printing technology on various commercially available paper substrates to provide the low-cost, flexible RF modules for the next generation of "green" electronics. The effects on electromagnetic characteristics of the planar Archimedean spiral antenna, due to the use of paper are investigated besides other parameters. The proposed antenna is evaluated and optimized for operational range from 0.8-3.0GHz. It exhibits exceptional coverage throughout numerous RFID ISM bands so do for other wireless applications.

  • 13.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Development and Analysis of Flexible UHF RFID Antennas For "Green" Electronics2012In: Progress In Electromagnetics Research-PIER, ISSN 1070-4698, Vol. 130, p. 1-15Article in journal (Refereed)
    Abstract [en]

    In this paper, novel Bowtie antennas which cover complete UHF RFID band (860-960MHz), fabricated on various ultra-low-cost substrates using state-of-the-art printing technologies are investigated as an approach that aims to accommodate the antenna during the package printing process whilst faster production on commercially available paper. The proposed antenna structures are evaluated in reference to circuit and field concepts, to exhibit extreme degree of functional versatility. These antennas are developed to cater the variations which appear in electromagnetic properties and thickness of paper substrate due to various environmental effects. Computed (simulated) and well-agreed measurement results confirm a superior performance of the tag modules while stepping towards next generation of "green" tags.

  • 14.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    "Green" Wideband Log-Spiral Antenna for RFID Sensing and Wireless Applications2012In: Journal of Electromagnetic Waves and Applications, ISSN 0920-5071, Vol. 26, no 14-15, p. 2043-2050Article in journal (Refereed)
    Abstract [en]

    The novel idea of integrating RFID with sensors along with other wireless applications by using single tag antenna is implemented, by fabricating proposed antenna using state-of-the-art inkjet printing technology on commercially available paper substrates. For the first time, a parametric analysis is performed for realization of planar log-spiral antenna on paper for operational range from 0.8-3.0GHz, which also exhibits excellent coverage throughout numerous RFID ISM bands, and for other wireless applications. The ANSYS HFSS tool is used to design and predict the performance of the proposed antenna in terms of radiation pattern and input impedance.

  • 15.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Two-arm Sinuous Antenna for RFID Ubiquitous Sensors and Wireless Applications2012In: Journal Electromagnetic Waves and Applications, ISSN 0920-5071, E-ISSN 1569-3937, Vol. 26, no 17-18, p. 2365-2371Article in journal (Refereed)
    Abstract [en]

    For the first time, two-arm planar sinuous antenna is demonstrated to realize the emerging concept of integrating RFID functionalities along with sensors and other wireless applications for "green" electronics. In-depth, parametric analysis is performed for the proposed antenna which is fabricated on a paper substrate using revolutionary inkjet printing technology to develop a system-level solution for ultra-low-cost mass production of multipurpose wireless tags in an approach that could be easily expanded to other microwave and wireless "cognition" applications. The proposed antenna exhibits excellent performance throughout several RFID ISM bands and for other wireless applications in its operational range from 0.8 to 3.0 GHz.

  • 16.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Feng, Yi
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    RFID antenna humidity sensor co-design for USN applications2013In: IEICE Electronics Express, ISSN 1349-2543, E-ISSN 1349-2543, Vol. 10, no 4, p. 20130003-Article in journal (Refereed)
    Abstract [en]

    We demonstrate for the first time an RFID tag antenna which itself is humidity sensor and also provides calibration functionality. The antenna is comprised of T-matching network and horizontally meandered lines for impedance matching and reliable near-field communication. The novel contour design provides humidity sensing, and calibration functions whilst concurrently acts as a radiating element along with quadrangular capacitive tip-loading with covered middle portion for far-field communication. The inkjet printed prototypes of the antenna provide effective ambient humidity sensing while demonstrating stable RFID communication. The antenna has a compact size of 1.1 x 10.2 cm for 902-928MHz band.

  • 17.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Kanth, R. K.
    Liljeberg, P.
    Akram, A.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Printable RFID antenna with embedded sensor and calibration functions2013In: Progress In Electromagnetics Research Symposium Proceedings, Stockholm, Sweden, Aug. 12-15, 2013, Electromagnetics Academy , 2013, p. 567-570Conference paper (Refereed)
    Abstract [en]

    An RFID antenna with integrated humidity sensor and calibration functionality for wireless sensor network is proposed. The antenna is composed of series and shunt stubs for impedance matching and reliability for near-field communication. The innovative ladder contour structure plays the key role for humidity sensing, and sensor calibration. The quadrangular end-tip loading is employed to offer capacitance and stability for far-field communication. The prototypes of the antenna are fabricated and tested: antenna effectively senses the ambient humidity levels while demonstrating stable behavior for RFID communication. The antenna has a compact size of 1 × 10cm for 902-928 MHz RFID band.

  • 18.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Kanth, Rajeev Kumar
    Turku Centre for Computer Science (TUCS).
    Liljeberg, Pasi
    Turku Centre for Computer Science (TUCS).
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Green wideband RFID tag antenna for supply chain applications2012In: IEICE Electronics Express, ISSN 1349-2543, Vol. 9, no 24, p. 1861-1866Article in journal (Refereed)
    Abstract [en]

    In this paper, we demonstrate an RFID tag antenna manufactured by advanced inkjet printing technology on paper substrate using novel hole-matching technique for reducing the consumption of substrate material and conductive ink while attaining green RFID tags. In-depth electromagnetic analysis is performed methodologically for optimizing the parameters that effectuate the antenna dimensions. The antenna design is optimized for consistent wideband performance and extended read range throughout the complete UHF RFID band (860-960MHz), while exhibiting benchmarking results when n across cardboard cartons filled with metal or water containing objects.

  • 19.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Kumar Kanth, Rajeev
    University of Turku, Finland.
    Liljeberg, Pasi
    University of Turku, Finland.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Performance-optimized Printed Wideband RFID Antenna and Environmental Impact AnalysisIn: ETRI Journal, ISSN 1225-6463, E-ISSN 2233-7326Article in journal (Refereed)
    Abstract [en]

    This paper presents performance optimized RFID tag antenna, developed by using commercially accessible paper substrates and advanced inkjet printing process to guarantee mechanical flexibility and ultra-low production costs. The proposed antenna structure can endure the variations which emerge in electromagnetic properties of paper substrate due to varying environmental effects. Hole-matching technique is implemented to eliminate the matching network for reducing the consumption of conductive ink. The proposed structure is uniquely evaluated by demonstrating, sustainability and environmental impact analysis that validate the potential for ultra-low cost mass production of RFID tags for future generation of organic electronics. The antenna performance is assessed for cardboard cartons exclusively containing metal cans and water bottles. The experimental characterization of the proposed antenna endorses the wider bandwidth to cover UHF RFID ISM band (860-960MHz), which empowers its usage throughout the globe for supply chain applications. The improved design effectuates return loss of better than -15dB over a wide frequency range while exhibiting outstanding readability from 10.1 meters.

  • 20.
    Amin, Yasar
    et al.
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Prokkola, Satu
    Shao, Botao
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Hållstedt, Julius
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Low Cost Paper Based Bowtie Tag Antenna for High Performance UHF RFID Applications2009In: NANOTECH CONFERENCE & EXPO 2009, VOL 1, TECHNICAL PROCEEDINGS - NANOTECHNOLOGY 2009: FABRICATION, PARTICLES, CHARACTERIZATION, MEMS, ELECTRONICS AND PHOTONICS / [ed] Laudon M; Romanowicz B, BOCA RATON: CRC PRESS-TAYLOR & FRANCIS GROUP , 2009, p. 538-541Conference paper (Refereed)
    Abstract [en]

    Radio frequency identification (RFID) antenna's versatility in terms of complete coverage of UHF RFID band (860-960 MHz), while keeping the cost factor low, is an important aspect of today's growing demand for security and tracking of multiple objects in a very short time in addition to tag's readability across the globe. This paper presents a novel inkjet printed rounded corner bowtie antenna with T-matching stubs on paper substrate which is the cheapest and widest available substrate. The antenna exhibits compact size with outstanding read range.

  • 21.
    Amin, Yasar
    et al.
    University of Engineering and Technology, Taxila, Punjab, Pakistan.
    Shao, Botao
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Electromagnetic Analysis of Radio Frequency Identification Antennas for Green Electronics2013In: Electromagnetics, ISSN 0272-6343, E-ISSN 1532-527X, Vol. 33, no 4, p. 319-331Article in journal (Refereed)
    Abstract [en]

    This article demonstrates in-depth electromagnetic analysis of a radio frequency identification tag antenna manufactured by inkjet printing technology on different paper substrates to achieve ultra-low cost flexible radio frequency identification tags using a novel hole-matching technique for reducing the consumption of substrate material, and conductive ink. Nevertheless, the electromagnetic properties of the paper substrate are vulnerable to various environmental effects. Thus, the proposed antenna design is optimized for consistent wideband performance throughout the complete UHF radio frequency identification band (860960 MHz) while presenting a greater degree of material insensitivity. An advanced antenna design methodological analysis is performed to accomplish an extended read range, while exhibiting benchmarking results when across cardboard cartons filled with metal or water containing objects.

  • 22.
    Ansari, Muhammad Adeel
    et al.
    KTH, School of Information and Communication Technology (ICT).
    Ahmad, Waqar
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Diode based charge pump design using 0.35μm technology2010In: 28th Norchip Conference, NORCHIP 2010, IEEE , 2010, p. 5669437-Conference paper (Refereed)
    Abstract [en]

    A high voltage charge pump design is being presented in this paper. The design is based on Dickson charge pump, constructed with diodes by using AMS 0.35μm technology. The innovation is made in Dickson charge pump i.e. charge control PMOS transistor is used in each stage of charge pump. PMOS transistor is used in series with charging capacitor which reduces the power consumption during the clock transition by controlling the time constant of each stage. The resistance between drain to source of PMOS transistor increases the time constant during the charging of the capacitor placed in each stage of charge pump. The output voltage of about 5.693V is achieved by the six stages of Dickson charge pump at no-load which reduces to 5.537V with the six stages of proposed charge pump but the power during the input clock transition is reduced from 340.5μw (consumed by Dickson charge pump) to 28.85 μW (consumed by the proposed modified charge pump). Some other results are also discussed in this paper, which are achieved on different load resistances.

  • 23.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Mueller, Matthias
    Xaar Jet AB.
    Zapka, Werner
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Inkjet Printed UWB Impulse-based Wireless Sensor for Flexible Electronics2012In: Gigahertz Symposium, 2012Conference paper (Other academic)
  • 24.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. Fudan University, China.
    Design of a Printable Multi-Functional Sensor for Remote Monitoring2011In: 2011 IEEE SENSORS Proceedings, IEEE Sensors Council, 2011, p. 675-678Conference paper (Refereed)
    Abstract [en]

    This paper proposes a novel printable multi-functional passive sensor for remote monitoring. The sensor mainly consists of a series of pairs of transmission lines and sensing resistors whose resistances vary with one physical parameter. A short-duration radio-frequency pulse as interrogation signal travels along the transmission line and is partially reflected at each resistor due to impedance mismatch. By measuring the energies of the discrete reflected pulses in time domain, all the physical parameters could be detected simultaneously. This design not only saves complex circuitry but also enables easy adaptation for detecting multiple parameters. We have theoretically analyzed the sensor assuming it has an arbitrary number of sensing resistors. The introduced algorithm between the pulse energies and resistances is verified by simulation. As a prototype, an inkjet-printed sensor on polyimide foil is presented. The experimental measurement has successfully proven the design concept. 

  • 25.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. Fudan University, China .
    Hållstedt, Julius
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Huang, Yiping
    Fudan University.
    Development and experimental verification of analytical models for printable interdigital capacitor sensors on paperboard2009In: 2009 IEEE Sensors, IEEE Sensors Council, 2009, p. 1034-1039Conference paper (Refereed)
    Abstract [en]

    Printed interdigital capacitor DWI on paperboard is a promising solution for low-cost sensors in intelligent packaging applications. The currently available analytical models of multi-layered IDCs are targeted to those fabricated by conventional semiconductor process. For this reason, we have adapted two promising models and assessed their accuracies by comparison with experimental data. We modified these models by treating the paper as non-infinite thick substrate and taking the effect of printed metal thickness into account. The models are studied further to reveal the relationship between the response of capacitance change and various geometric parameters which enables a quick way of obtaining the optimum IDC structure design. The modified Gevorgian model fits our experimental data best, and the sensitivity of IDCs is largely affected by its spatial wavelength and the thickness of sensing material layer, while the finger number, length and metallization ratio have minor impact.

  • 26.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Lopez Cabezas, Ana
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zhang, Zhi-Bin
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Flexible UHF Resistive Humidity Sensors Based on Carbon Nanotubes2012In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 12, no 9, p. 2844-2850Article in journal (Refereed)
    Abstract [en]

    This paper presents the investigation of the resistive humidity-sensing properties of multi-walled carbon nanotubes (MWCNTs). MWCNTs functionalized by acid treatment (f-MWCNTs) exhibit rather high sensitivity in resistance toward humidity, owing to the presence of carboxylic groups on the nanotube surface. By integrating the f-MWCNTs resistor into a wireless sensor platform, flexible humidity sensors for ultra-high frequency applications are investigated. The operating frequency range of the sensor is dramatically increased from 600 MHz to 2 GHz by adjusting the resistor-electrodes' configuration. This enhancement is predominately attributed to the variation in parasitic capacitance between the resistor-electrodes.

  • 27.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Mueller, Matthias
    Xaar Jet AB.
    Liebeskind, Jens
    Xaar Jet AB.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Schmidt, Wolfgang
    Felix Schoeller GmbH & Co. KG.
    Zapka, Werner
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Characterization of Inkjet Printed Coplanar Waveguides for Flexible Electronics2011In: NIP27: International Conference on Digital Printing Technologies and Digital Fabrication 2011: TECHNICAL PROGRAMS, ABSTRACTS, AND CD PROCEEDINGS, IS & T , 2011, p. 454-457Conference paper (Refereed)
    Abstract [en]

    The low conductivity and thin layers of the inkjet-printed metal conductors have always been a big concern in paper-based printed electronics for high frequency applications. To provide the fundamental knowledge, the high frequency characteristics of inkjet-printed coplanar waveguides on paper substrate were studied experimentally in terms of characteristic impedance and conductor losses using the time domain reflectometry technique. The influences of different printing settings and of geometric parameters on the waveguide's properties were investigated. Considering the measurement accuracy in high frequency characterization, one sample with an impedance of 51.2Ω was achieved. The electrical stability of the samples was also studied and explained. In addition, one waveguide sample was printed in a way that the pattern area with the highest current density is thickened. This variable ink-layer thickness approach has successfully been proven as a promising solution to reduce the conductor losses and yet consuming less ink.

  • 28.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Xie, Li
    KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Low Cost Printed Chipless RFID Humidity Sensor Tag for Intelligent Packaging2015In: IEEE Sensors Journal, ISSN 1530-437X, E-ISSN 1558-1748, Vol. 15, no 6, p. 3201-3208Article in journal (Refereed)
    Abstract [en]

    This paper presents a fully-printed chipless radio frequency identification sensor tag for short-range item identification and humidity monitoring applications. The tag consists of two planar inductor-capacitor resonators operating wirelessly through inductive coupling. One resonator is used to encode ID data based on frequency spectrum signature, and another one works as a humidity sensor, utilizing a paper substrate as a sensing material. The sensing performances of three paper substrates, including commercial packaging paper, are investigated. The use of paper provides excellent sensitivity and reasonable response time to humidity. The cheap and robust packaging paper, particularly, exhibits the largest sensitivity over the relative humidity range from 20% to 70%, which offers the possibility of directly printing the sensor tag on traditional packages to make the package intelligent at ultralow cost.

  • 29.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Xie, Li
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Mueller, Maik
    Xaar Jet AB.
    Lopez Cabezas, Ana
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Mantysalo, Matti
    Forsberg, Fredrik
    KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zapka, Werner
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Fabrication and performance evaluation of ultralow-cost inkjet-printed chipless RFID tags2012Conference paper (Refereed)
    Abstract [en]

    This paper studies the performance of inkjet-printed chipless RFID tags based on planar inductor-capacitor resonant circuits. Besides using double-sided printing, a sandwiching process is introduced to fabricate the tags in order to eliminate the need of through-substrate via and match roll-to-roll processing. Due to lower conductivity (~1.25E+7 S/m) and smaller thickness (~1.7μm) of printed conductors with silver nanoparticle ink, the resonant peaks of inkjet-printed tags exhibit around as twice of half-power bandwidth and 60% of maximum reading distance as the etched tags from bulk copper. Nevertheless, the inkjet-printed tag performance is sufficient for many applications, and it can be adjusted and improved by printing and sintering processes.

  • 30.
    Feng, Yi
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Xie, Li
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Mäntysalo, Matti
    Tampere University of Technology, Finland.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Electrical and humidity-sensing characterization of inkjet-printed multi-walled carbon nanotubes for smart packaging2013In: IEEE SENSORS 2013 - Proceedings, IEEE , 2013, p. 1-4Conference paper (Refereed)
    Abstract [en]

    Printing is considered a cost-effective way to fabricate electronics on unconventional substrates enabling, for example, smart packaging. Functionalized multi-walled carbon nanotubes (f-MWCNTs) having carboxylic groups on their surfaces possess great potential as flexible resistive humidity sensor. In this paper, we report on the inkjet printing and characterization of f-MWCNTs in terms of sheet resistance and humidity-sensitivity. Stable f-MWCNTs ink is formulated using aqueous ethylene glycol as solvent. Sheet resistance of printed f-MWCNTs films on polyimide foil reduces by increasing the number of printed layers as well as post-printing annealing temperature. Meanwhile, the raised annealing temperature degrades the films' humidity-sensitivity, which could be explained by the loss of the carboxylic groups. The electrical and sensing properties of f-MWCNTs also have a negative temperature coefficient regarding ambient temperature, which should be considered in practical application.

  • 31.
    Gao, Jie
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Pang, Zhibo
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    A Study on Electrical Properties of Controlled Delamination MaterialManuscript (preprint) (Other academic)
    Abstract [en]

    Primarily used in aerospace applications, Controlled Delamination Material (CDM) has recently drawn attention to the traditional packaging industry due to its low-cost and electrical easy-open. Sinuate®, a CDM product, consists of two aluminum foils bonded together with a conductive epoxy adhesive. When applying a little electricity on its surface, the material can open easily without violence and release without residue. In this paper, a brief introduction on Sinuate® will be presented at first. And some test results on the electrical properties of the joint opening/detaching process will be shown and analyzed.

  • 32.
    Gao, Jie
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Pang, Zhibo
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Interactive Packaging Solutions Based on RFIDTechnology and Controlled Delamination Material2010Conference paper (Refereed)
    Abstract [en]

    Interactive packaging is an emerging research area in recent years. It brings people convenient and smart lives, reduces consumption of traditional packaging materials and direct or indirect labor costs as well. Being integrated in interactive packaging, Radio Frequency Identification (RFID) technology becomes one of the most proactive development enablers. In this paper, an interactive and intelligent packaging solution integrating passive RFID system and Controlled Delamination Material (CDM) is given at first. Package opening action is electrically controlled by the RFID system. CDM is primarily used in aerospace applications in the past and the conductor/adhesive joint can be easily opened by applying a little electric power on to the material. Some related works will be shown about the electrochemical characteristics of CDM in order to facilitate the system design. A demonstration system was developed and the test results have proved feasibility of the solution and shown the potential of low cost for mass production. Based on this solution, an interactive medication package for pervasive healthcare is further developed, using EPCglobal Gen2 RFID technology. It will make the medication being accessible for patient only at the prescribed dose and time, and medication taking information will be delivered as well. Such medication package will not only give unprecedented high patient compliance, but also improve the communication between patients and healthcare staffs.

  • 33.
    Jun, Chen
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Pang, Zhibo
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Zhang, Zhi
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Gao, Jie
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
    A Novel Acceleration Data Compression Scheme for Wireless Sensor Network Application in Fresh Food Tracking System2009In: The Ninth International Conference on Electronic Measurement & Instruments ICEMI’2009, IEEE Press, 2009, p. 3-1-3-5Conference paper (Refereed)
    Abstract [en]

    An enhanced dual-layer wide area wireless sensor network (WSN) system was developed and applied in fresh food tracking application. The sensor nodes of WSN provide a set of useful measurements about the environmental conditions during the fresh food transportation. Since the 3-axis acceleration data in such application account for more than 99% out of all collected source data, we propose a novel acceleration data compression scheme for this specific application, to overcome the resource and cost limitation imposed on embedded sensing nodes and wireless communication links in WSN. According to general fresh food transport behavior pattern, the acceleration data can be extracted into three components (D waveform, A waveform and P waveform). Each component could be compressed separately according to its distinct characteristic and then packetized as an encoded frame. In this paper we examine the experimental acceleration dataset from a field test (fresh melon fruit transport from Brazil to Sweden in 20 days) as a test case. Experimental results show that a high compression ratio (around 10:1) with the acceptable distortion could be achieved, confirming the effectiveness of the compression scheme proposed in this work.

  • 34.
    Kanth, R. K.
    et al.
    Turku Centre for Computer Science (TUCS).
    Kumar, H.
    Liljeberg, P.
    Turku Centre for Computer Science (TUCS).
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Exploring course development for green ICT in engineering education: A preliminary study2012In: AICERA 2012 - Annual International Conference on Emerging Research Areas: Innovative Practices and Future Trends, IEEE , 2012, p. 6306685-Conference paper (Refereed)
    Abstract [en]

    This paper aims to give an insight into the importance of green ICT course in the curriculum of Master and PhD level studies. An attempt has been made to demonstrate its necessity, implementation issues and strategic plans to execute this course. General structural plans along with details of the course content are discussed in this paper. The course aims to provide a unified view of sustainable embedded system technologies, practices of using efficiently computers and telecommunication equipments, environmental assessment strategies and life cycle management of electronic components as well as end-products. The objective of this new course is to give knowledge and foresight toward assessment of environmental impacts. This course will also be capable of imparting knowledge of sustainable design approach in life cycle of the materials, manufacturing processes, use/reuse and recycling of the electronic equipments and components. The course has been proposed of 5 ECTS credit units inclusive of extensive theoretical lectures and lab exercises using suitable environmental assessment software tools.

  • 35.
    Kanth, R. K.
    et al.
    Turku Centre for Computer Science (TUCS).
    Liljeberg, P.
    Turku Centre for Computer Science (TUCS).
    Amin, Yasar
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Comparative End-of-Life Study of Polymer and Paper Based Radio Frequency Devices2012In: International Journal of Environmental Protection, ISSN 2224-7777, Vol. 2, p. 23-27Article in journal (Refereed)
    Abstract [en]

    In this work end-of-life (EOL) analysis of polymer and paper based radio frequency devices have been carried out. Polymer and paper based RFID antenna has been chosen as a radio frequency device. An attempt has been made to investigate and evaluate the environmental emissions at end-of-life-cycle stage and to explore type and quantity of emissions at their disposal. The Gabi’s balance calculation methodology has been employed to determine amount of environmental emissions at the end-of-life cycle stage. Each significant component of the antenna and their corresponding emissions has been investigated in this paper. We have also compared the corresponding emissions to air and fresh water in both the technologies i.e. incineration and land-filling at EOL stage.

  • 36. Kanth, R. K.
    et al.
    Liljeberg, P.
    Tenhunen, Hannu
    Turku Centre for Computer Science, University of Turku, Finland.
    Amin, Yasar
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Janstch, Axel
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Kumar, H.
    Design of sierpinski grid patch antenna for multiband application2013In: Progress In Electromagnetics Research Symposium Proceedings, Stockholm, Sweden, Aug. 12-15, 2013, 2013, p. 577-582Conference paper (Refereed)
    Abstract [en]

    The purpose of this paper is two-fold. Firstly, we have attempted to design a planar Sierpinski fractal antenna with stacked configuration for multiband applications. The stacked configuration of Sierpinski fractal patch and Sierpinski grid are employed to improve the multiband characteristics. The operating frequencies obtained are at 3.3 GHz, 5GHz, 5.74 GHz and 5.9 GHz which covers the bands useful for HIPERLAN2 frequencies and for implementation in futuristic WiFi enabled devices and PCI Cards for mobile internet. The Simulated results show that the operating frequencies obtained are spread over a wide range of frequency band compared to the simple Sierpinski fractal patch antenna. Secondly this paper aims at evaluating the sustainability and life cycle management of proposed antenna.

  • 37.
    Kanth, R. K.
    et al.
    Turku Centre for Computer Science (TUCS).
    Liljeberg, P.
    Turku Centre for Computer Science (TUCS).
    Tenhunen, Hannu
    Amin, Yasar
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Kumar, H.
    Quantifying the environmental footprint of rigid substrate printed antenna2012In: Proceedings of the 2012 IEEE Conference on Technology and Society in Asia, T and SA 2012, IEEE , 2012, p. 6397973-Conference paper (Refereed)
    Abstract [en]

    Quantifying environmental footprint is an important task for the embedded system researcher as this study keep them aware of environmental impacts' threat toward green and healthy living of human beings. In this work we have presented a study on analysis of sustainability and environmental impacts assessment in manufacturing process of rigid substrate printed antennas. Life cycle assessment approach has been employed to quantify and asses the environmental footprint. A case study has been carried out for epoxy resin substrate based tip truncated equilateral triangle microstrip antenna. The subtractive printing methodology have been conducted to trace the required antenna pattern. The output parameters have been analyzed in terms of global warming potential, ozone layer depletion potential, human toxicity and acidification potential. Gabi's balance approach has been utilized to analyze the environmental emissions to the air, fresh water, sea water, agricultural and industrial soils. The consumption of resources has also been shortly described in this paper.

  • 38.
    Kanth, R. K.
    et al.
    Turku Centre for Computer Science (TUCS).
    Liljeberg, P.
    Turku Centre for Computer Science (TUCS).
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Janstch, Axel
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Kumar, H.
    Varshney, L.
    Turku Centre for Computer Science (TUCS).
    Design of Sierpinski Grid Patch Antenna for Multiband Application and Sustainability Analysis in its Manufacturing Process2012In: IEEE International Conference on Industrial Technology, 2012, p. 1-5Conference paper (Refereed)
    Abstract [en]

    The purpose of this paper is two-fold. Firstly, we have attempted to design a planar Sierpinski fractal antenna in stacked configuration for multiband application. The stacked configuration of Sierpinski fractal patch and Sierpinski grid are employed to improve the multiband characteristics. The operating frequencies obtained are at 3.3 GHz, 5 GHz, 5.74 GHz and 5.9 GHz which covers the bands useful for HIPERLAN2 frequencies and for implementation in futuristic WiFi enabled devices and PCI Cards for mobile internet. The Simulated results show that the operating frequencies obtained are spread over a wide range of frequency band compared to the simple Sierpinski fractal patch antenna. Secondly this paper aims at evaluating the sustainability and life cycle management of proposed antenna.

  • 39. Kanth, R. K.
    et al.
    Liljeberg, P.
    Tenhunen, Hannu
    University of Turku, Finland.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Kumar, Harish
    KTH, School of Information and Communication Technology (ICT).
    Comparative toxic emission analysis in production process of polymer and paper Based RFID tags2012In: 2012 11th International Conference on Environment and Electrical Engineering, EEEIC 2012 - Conference Proceedings, IEEE , 2012, p. 184-187Conference paper (Refereed)
    Abstract [en]

    A balance optimization method has been employed to determine the quantity of toxic emissions particularly in emissions to air, fresh water, sea water and industrial soil, in production process of polymer and paper based RFID tags. We have developed a low profile antenna design for passive UHF RFID tags using both polymer and paper substrate with copper and aluminum for the antenna trace. Comparative analysis of toxic emissions during production process of polymer and paper based RFID antennas have been discussed in this paper. Our results show that paper based RFID antennas yield lower organic emissions to the environment while considerably higher inorganic emissions to the air. The results also depict that air is highly affected with the toxic emissions compared to fresh water, sea water and industrial soil.

  • 40. Kanth, R. K.
    et al.
    Wan, Qiansu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Kumar, H.
    Liljeberg, P.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, LiRong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tenhunen, Hannu
    University of Turku.
    Evaluating sustainability, environment assessment and toxic emissions in life cycle stages of printed antenna2012In: International Conference On Communication Technology And System Design 2011, Elsevier, 2012, Vol. 30, p. 508-513Conference paper (Refereed)
    Abstract [en]

    In this work cradle to grave life cycle assessment of printed electronics resources have been presented. An attempt has been made to investigate and evaluate the life cycle assessment and environmental impacts of printed electronics resources such as polymer substrate-printed RFID antenna. Life cycle inventory analysis for these resources has been carried out to quantify total systems' inputs and outputs that are relevant to the environmental impacts especially emissions to air, fresh water, industrial soil and sea water. The results show that printed electronics materials are considerably more environment friendly than materials needed for PCB electronics. We have obtained the mass of emissions in each life cycle stages which verify that technology wise printed antenna causes less harmful and hazardous impacts to the environment.

  • 41. Kanth, Rajeev Kumar
    et al.
    Liljeberg, Pasi
    Tenhunen, Hannu
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Kumar, Harish
    Study on Glass-Epoxy-Based Low-Cost and Compact Tip-Truncated Triangular Printed Antenna2012In: International Journal of Antennas and Propagation, ISSN 1687-5869, E-ISSN 1687-5877, p. 184537-Article in journal (Refereed)
    Abstract [en]

    Printed antennas based on glass epoxy substrate have been developed. On the basis of required specifications and assigned frequencies, tip-truncated triangular printed antennas have been designed, analyzed, and fabricated. The performances of the antennas have been measured in terms of return loss, frequency of operation, bandwidth, and radiation pattern. Triangular microstrip antenna (TMSA) configuration consisting of copper as active radiating patch and glass epoxy as dielectric substrate has been screened out to achieve the essential characteristics and satisfying recommended low-cost antenna. The Method of Moment (MOM) analyzing techniques have been employed to realize the required specific properties, whereas optimized tip truncation technique and varying feed point location give rise to suitable LHCP or RHCP configuration of the printed antenna. The coaxial probe signal feed arrangement have been considered for this work. The proposed printed antennas are suitable for communication links between ships or buoys and satellites specially for navigation purpose.

  • 42.
    Kanth, Rajeev Kumar
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Liljeberg, Pasi
    Tenhunen, Hannu
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Wan, Qiansu
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Amin, Yasar
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Shao, Botao
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Kumar, Harish
    Evaluating Sustainability, Environmental Assessment and Toxic Emissions during Manufacturing Process of RFID Based Systems2011In: Dependable, Autonomic and Secure Computing (DASC), 2011 IEEE Ninth International Conference on, 2011, p. 1066-1071Conference paper (Refereed)
    Abstract [en]

    The present state of the art research in the direction of embedded systems demonstrate that analysis of life-cycle, sustainability and environmental assessment have not been a core focus for researchers. To maximize a researcher's contribution in formulating environmentally friendly products, devising green manufacturing processes and services, there is a strong need to enhance life-cycle awareness and sustainability understandings among embedded systems researchers, so that the next generation of engineers will be able to realize the goal of a sustainable life-cycle. In this work an attempt has been made to investigate and evaluate the life-cycle management and environmental assessment in fabricating processes of the RFID based systems. We have chosen a general life cycle assessment approach which involves the collection and evaluation of quantitative data on the inputs and outputs of materials and energy associated with the RFID based systems. Based on the developed generic models, we have obtained the results in terms of environmental emissions for a production of paper substrate printed RFID antennas. We also make an attempt to raise several sustainability issues and quantify the toxic emissions during the manufacturing process.

  • 43.
    Li, Molan
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Xu, Shaohui
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Thermoelectric-Generator-Based DC-DC Conversion Networks for Automotive Applications2011In: Journal of Electronic Materials, ISSN 0361-5235, E-ISSN 1543-186X, Vol. 40, no 5, p. 1136-1143Article in journal (Refereed)
    Abstract [en]

    Maximizing electrical energy generation through waste heat recovery is one of the modern research questions within automotive applications of thermoelectric (TE) technologies. This paper proposes a novel concept of distributed multisection multilevel DC-DC conversion networks based on thermoelectric generators (TEGs) for automotive applications. The concept incorporates a bottom-up design approach to collect, convert, and manage vehicle waste heat efficiently. Several state-of-the-art thermoelectric materials are analyzed for the purpose of power generation at each waste heat harvesting location on a vehicle. Optimal materials and TE couple configurations are suggested. Moreover, a comparison of prevailing DC-DC conversion techniques was made with respect to applications at each conversion level within the network. Furthermore, higher-level design considerations are discussed according to system specifications. Finally, a case study is performed to compare the performance of the proposed network and a traditional single-stage system. The results show that the proposed network enhances the system conversion efficiency by up to 400%.

  • 44. Liu, Zhiying
    et al.
    Zhang, Zhi-Bin
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zhang, Shi-Li
    Solution-Processable Nanotube/Polymer Composite for High-Performance TFTs2011In: IEEE Electron Device Letters, ISSN 0741-3106, E-ISSN 1558-0563, Vol. 32, no 9, p. 1299-1301Article in journal (Refereed)
    Abstract [en]

    Thin-film field-effect transistors (TFTs) are readily fabricated using a semiconductor composite that is solution processed under ambient conditions for the conduction channel. The composite comprises single-walled carbon nanotubes (SWCNTs) embedded in poly-9,9' dioctyl-fluorene-co-bithiophene. Carrier mobility values approaching 10 cm(2)V(-1)s(-1) are obtained for the composite with relatively high SWCNT concentrations. When the SWCNT concentration is reduced for a large ON/OFF current ratio > 10(6), the mobility remains decent around 0.3 cm(2)V(-1)s(-1). The resultant TFTs display remarkable environmental and operational reliability. Nanotube-based composites are therefore of significance in printed electronics owing to their simplicity in device fabrication and competitiveness in device performance.

  • 45.
    Lopez Cabezas, Ana
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Liu, Xianjie
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zhang, Shi-Li
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zhang, Zhi-Bin
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Influence of Carbon Nanotubes on Thermal Stability of Water-Dispersible Nanofibrillar Polyaniline/Nanotube Composite2012In: Materials, ISSN 1996-1944, E-ISSN 1996-1944, Vol. 5, no 2, p. 327--335Article in journal (Refereed)
    Abstract [en]

    Significant influence on the thermal stability of polyaniline (PANI) in the presence of multi-walled carbon nanotubes (MWCNTs) is reported. By means of in-situ rapid mixing approach, water-dispersible nanofibrillar PANI and composites, consisting of MWCNTs uniformly coated with PANI in the state of emeraldine salt, with a well-defined core-shell heterogeneous structure, were prepared. The de-protonation process in PANI occurs at a lower temperature under the presence of MWCNTs on the polyaniline composite upon thermal treatment. However, it is found that the presence of MWCNTs significantly enhances the thermal stability of PANI's backbone upon exposure to laser irradiation, which can be ascribed to the core-shell heterogeneous structure of the composite of MWCNTs and PANI, and the high thermal conductivity of MWCNTs.

  • 46. Pang, Z.
    et al.
    Tian, Junzhe
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Intelligent packaging and intelligent medicine box for medication management towards the Internet-of-Things2014In: 2014 16th International Conference on Advanced Communication Technology (ICACT), IEEE , 2014, p. 352-360Conference paper (Refereed)
    Abstract [en]

    The medication noncompliance problem has caused serious threat to public health as well as huge financial waste would wide. The emerging pervasive healthcare enabled by the Internet-of-Things offers promising solutions. In addition, an in-home healthcare station (IHHS) is needed to meet the rapidly increasing demands for daily monitoring and on-site diagnosis and prognosis. In this paper, a pervasive and preventive medication management solution is proposed based on intelligent and interactive packaging (I2Pack) and intelligent medicine box (iMedBox). The intelligent pharmaceutical packaging is sealed by the Controlled Delamination Material (CDM) and controlled by wireless communication. Various vital parameters can also be collected by wearable biomédical sensors through the wireless link. On-site diagnosis and prognosis of these vital parameters are supported by the high performance architecture. Additionally, friendly user interface is emphasized to ease the operation for the elderly, disabled, and patients. A prototyping system of the I2Pack and iMedBox is implemented and verified by field trials.

  • 47.
    Pang, Zhibo
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Jun
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Sarmiento Mendoza, David
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zhang, Zhi
    KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Gao, Jie
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Li-Rong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Mobile and Wide Area Deployable Sensor System for Networked Services2009In: 2009 IEEE SENSORS: VOLS 1-3, NEW YORK: IEEE , 2009, p. 1329-1332Conference paper (Refereed)
    Abstract [en]

    A mobile and wide area deployable wireless sensor system, including hardware and software, is developed to enhance the mobility, deployment and capability of wireless sensors for networked services. Due to the dual-layer dual-directional wireless communication capability of a novel WAN-SAN coherent architecture and the removal of fix-installed gateway, all sensor nodes are remotely controllable and seamlessly integrated to internet services. Hardware modules are optimized for ultra low power and compact size. Abstract and extendable application interface is developed, based on SMS and TCP/UDP protocol, to be integrated easily into existing service systems. Hierarchical CPS-LPS Adaptive Localization, is supported based on CPS, wireless cellular ID, RFID, IR-UWB and inertial prediction. Specific data compression technique is adopted for high density data source. Finally, Fresh Food Tracking service is presented as an application example, including some field test data.

  • 48.
    Pang, Zhibo
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Jun
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zhang, Zhi
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Global Fresh Food Tracking Service Enabled by Wide Area Wireless Sensor Network2010In: 2010 IEEE Sensors Applications Symposium, SAS 2010, IEEE Sensors Council, 2010, p. 6-9Conference paper (Refereed)
    Abstract [en]

    A global fresh food tracking service is presented, in which a set of primary environmental conditions for transport of fresh fruits and vegetables, including global position, temperature, relative humidity, concentrations of CO2, O2 and ethylene gases and 3-axis acceleration, is collected through mobile and remotely controllable wireless sensor nodes. Real time monitoring, tracking, alarming, close-loop controlling and information sharing could therefore be provided as WEB services with service oriented architecture. Fully functioned hardware modules, protocols and system software have been developed. A 50-day field test has been successfully carried out, proving the system concept and the robustness of hardware and software designed. Due to its worldwide deploy-ability and added-values to fresh food supply chain, it is feasible to establish a practical fresh food tracking service business.

  • 49.
    Pang, Zhibo
    et al.
    ABB Corporate Research.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Tian, Junzhe
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Dubrova, Elena
    KTH, School of Information and Communication Technology (ICT), Electronic Systems.
    Ecosystem analysis in the design of open platform-based in-home healthcare terminals towards the internet-of-things2013In: International Conference on Advanced Communication Technology, ICACT, ISSN 1738-9445, p. 529-534Article in journal (Refereed)
    Abstract [en]

    In-home healthcare services based on the Internet-of-Things (IoT) have big potential in business. To exploit this opportunity, an ecosystem should be established first. Technical solutions should aim for a cooperative ecosystem by addressing the interoperability, security, and system integration. In this paper, we propose an ecosystem-driven design strategy and apply it in the design of an open-platform based solution. In particular, a cooperative ecosystem is formulated by merging the traditional healthcare and mobile internet ecosystems. Utilizing the existing standardization efforts, the interfaces between actors can be simplified. To balance the control and avoid monopoly, ecosystem-driven security schemes are proposed including the public-based authentication, repository-based credential management, SE-based cryptography, and non-invasive message handover. In order to achieve the economy of scale, an open platform-based in-home healthcare station is proposed. The proposed methodology and solution are demonstrated in implemented prototype system and field trials.

  • 50.
    Pang, Zhibo
    et al.
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Chen, Qiang
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    Zheng, Lirong
    KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
    A Global Fresh Food Tracking Service Based on Novel Wireless Sensor and RFID Technologies2009Conference paper (Refereed)
    Abstract [en]

    A global fresh food tracking service is presented, in which a set of real-time primary environmental conditions for transport of fresh fruits and vegetables, including global position, temperature, relative humidity, concentrations of CO2, O2 and ethylene gases and 3-axis acceleration, is collected through mobile and remotely controllable wireless sensor nodes. Real time monitoring, tracking, alarming, close-loop controlling and information sharing could therefore be provided as WEB services with service oriental architecture. Fully functioned hardware modules, protocols and system software have been developed. A 50-day field test has been successfully carried out, proving the system concept and the robustness of hardware and software designed. Due to its worldwide deploy-ability and added-values to fresh food supply chain, it is now feasible to establish a practical fresh food tracking service business.

12 1 - 50 of 85
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