Open this publication in new window or tab >>Show others...
2024 (English)In: Small Methods, E-ISSN 2366-9608, Vol. 8, no 7, article id 2301247Article in journal (Refereed) Published
Abstract [en]
Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g., high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2O3, glass and flexible polyethylene, is demonstrated, enabled by electron-beam-induced reduction in a highly confined liquid electrolyte reservoir. The nanometer-size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells can offer greater flexibility toward deposition on arbitrary substrate geometries and materials. Installed in a low-vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.
Place, publisher, year, edition, pages
Wiley, 2024
Keywords
3D Nanofabrication, additive manufacturing, electron microscopy, microscale, nanoscale
National Category
Other Materials Engineering
Identifiers
urn:nbn:se:kth:diva-366449 (URN)10.1002/smtd.202301247 (DOI)001137127800001 ()38183406 (PubMedID)2-s2.0-85181501661 (Scopus ID)
Note
QC 20250708
2025-07-082025-07-082025-07-08Bibliographically approved