Open this publication in new window or tab >>State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China; School of Physics and Astronomy, University of Nottingham, Nottingham, UK.
State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China.
Center for Joining and Electronic Packaging, State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China; Wuhan National High Magnetic Field Center, Huazhong University of Science and Technology, 430074, Wuhan, China.
Center for Joining and Electronic Packaging, State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China; Wuhan National High Magnetic Field Center, Huazhong University of Science and Technology, 430074, Wuhan, China.
State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, China.
State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, China.
State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China.
State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China.
School of Electrical and Electronic Engineering, Tiangong University, Tianjin, China.
School of Physics and Astronomy, University of Nottingham, Nottingham, UK.
Center for Joining and Electronic Packaging, State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China; Wuhan National High Magnetic Field Center, Huazhong University of Science and Technology, 430074, Wuhan, China.
State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China.
State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, China.
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2025 (English)In: Nature Communications, E-ISSN 2041-1723, Vol. 16, no 1, article id 9509Article in journal (Refereed) Published
Abstract [en]
Two-dimensional van der Waals (vdW) ferromagnetic/semiconductor heterojunctions provide an ideal platform for studying and exploiting tunneling magnetoresistance (TMR) effects, due to the versatile band structure of semiconductors and high quality of their interfaces. In all-vdW magnetic tunnel junction (MTJ) devices, both the magnitude and sign of TMR can be tuned by an applied voltage. Typically, as the bias voltage increases, the amplitude of TMR initially decreases, followed by a reversal and/or oscillation in its sign. Herein, we report on an unconventional bias-dependent TMR observed in all-vdW Fe<inf>3</inf>GaTe<inf>2</inf>/GaSe/Fe<inf>3</inf>GaTe<inf>2</inf> MTJs, where TMR first increases, then decreases, and ultimately undergoes a sign reversal as the bias voltage increases. By considering the coherent degree of in-plane electron momentum k∥ and the decay of the electron wave function through the semiconductor spacer layer, our theoretical prediction successfully explains this unconventional bias-dependent TMR. Consequently, our results offer a deeper understanding of bias-dependent spin-transport in semiconductor-based MTJs and provide new insights into semiconductor spintronics.
Place, publisher, year, edition, pages
Springer Nature, 2025
National Category
Condensed Matter Physics
Identifiers
urn:nbn:se:kth:diva-372623 (URN)10.1038/s41467-025-64551-3 (DOI)001604755900021 ()41152221 (PubMedID)2-s2.0-105020199455 (Scopus ID)
Note
QC 20251111
2025-11-112025-11-112025-11-11Bibliographically approved