Micro- and nanoscale patterning of conformal thin-film coatings on the exterior surfaces of complex three-dimensional (3D) structures is essential for emerging applications such as soft robotics, photonics, and functional 3D-printed MEMS devices. However, existing methods struggle to deliver high-resolution patterning on complex 3D structures and often suffer from poor thickness control, and inadequate surface conformity of the thin-film coatings. Here we present a robust approach for patterning of conformal thin-film coatings on complex 3D structures, including on sloped surfaces with angles up to 90°, with multiscale dimensions from 100 μm to 100 nm, and even down to the sub-30 nm scale when mask shrinkage techniques are used. This patterning approach utilizes a lithographically defined 3D Scaffold-Architected Lift-Off (SALO) mask in the lift-off process. It is agnostic to the used thin-film deposition process and enables even lift-off patterning of atomic layer deposited (ALD) conformal coatings, a task infeasible for conventional shadowing-based lift-off processes. Our approach opens opportunities for manufacturing complex 3D structures at the micro- and nanoscale by enabling lithographic patterning on the exterior surfaces of arbitrary 3D structures.

We investigate the influence of plasmonic nanopores geometry on flow-through single-molecule SERS during electrophoretic molecular delivery. Using microsecond-resolved SPAD detection, we compare circular, slit, and V-shaped nanopores. Experiments and simulations show enhanced SERS efficiency for the slit and Vshaped pores, highlighting geometry as a key parameter for SERSbased molecular sensing.

Nanopores in ultrathin membranes are central to single-molecule sensing, filtration, and energy conversion applications, yet fabrication of solid-state nanopores remains limited by fundamental trade-off between resolution, throughput, and tool complexity. Here, we report a scalable nanopore fabrication process that exploits stress-induced mechanical ripping to detach a fragment from a membrane with lateral dimensions in the nm-scale, forming pores with diameters down to the sub-10 nm regime, which is well below the resolution limit of the employed lithography. Using this approach, we demonstrate wafer-scale fabrication of nanopores at densities exceeding 105 pores per cm2 in dielectric (HfO2), semiconducting (SiGe), and metallic (Cr) membranes, including suspended HfO2 membranes as thin as 2 nm. We demonstrate the utility of the fabricated nanopores for high-performance surface enhanced Raman readouts of single molecule translocations. Beyond nanopore fabrication, this fracture-based approach points to broader opportunities for nanometer- and atomic-scale structuring of ultrathin materials.

Single-molecule trapping and analysis are critical in understanding biomolecular processes at an unprecedented resolution. Traditional nanopore systems often face limitations in scalability and integration with electronic components, which complicates their use in compact, high-density applications. Addressing these challenges, we introduce a novel on-chip nanopore array system integrated with a silver (Ag) electrode and self-aligned femtolitersized cavities, representing an innovative approach for electronic single-molecule trapping. Our design utilizes a wafer-scale fabrication process with a buried electrode architecture, enabling the scalable production of high-density nanopore arrays without the need for through-wafer etching. Successful DNA translocation measurements demonstrate the system's potential as a versatile platform for single-molecule trapping and reaction studies.

Nanopores in ultrathin membranes are central to single-molecule sensing, filtration, and energy conversion, yet fabrication of solid-state nanopores remains limited by fundamental trade-off between resolution, throughput, and tool complexity. Here, we report a scalable process that exploits stress-induced mechanical ripping in ultrathin membranes to detach a nanoscale membrane patch, enabling the deterministic formation of sub-lithographic nanopores scaling down to the sub-10 nm regime. Using this approach, we demonstrate wafer scale fabrication of nanopores at densities exceeding 10⁵ pores per cm² in dielectric (HfO₂), semiconducting (SiGe), and metallic (Cr) membranes, including suspended HfO₂ membranes as thin as 2 nm. We demonstrate the utility of the fabricated nanopores for high-performance surface enhanced Raman readouts of single molecule translocations. Beyond nanopore fabrication, this fracture-based approach points to broader opportunities for nanometer- and atomic-scale structuring of ultrathin materials.