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2026 (English)In: IEEE Electron Device Letters, ISSN 0741-3106, E-ISSN 1558-0563, Vol. 47, no 3, p. 598-601Article in journal (Refereed) Published
Abstract [en]
Nanoelectromechanical (NEM) switches have near vertical turn-off transient, zero off-state leakage, and non-volatile behavior, ideal qualities for low power computing and memory applications. To realize this potential, large-scale integration of NEM switches is required. Here we introduce a three-dimensional (3-D) heterogeneous integration platform that leverages a standard silicon-on-insulator (SOI) CMOS foundry process, combined with post-processing of the foundry wafers to integrate silicon NEM switches. Within this platform, we seamlessly integrated both volatile 3-terminal (3-T) and nonvolatile 7-terminal (7-T) NEM switches. We demonstrate successful electrical programming and reprogramming of both switch types, validating the platform’s functionality and its potential for constructing densely integrated NEM switch-based logic circuits and non-volatile memories.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2026
Keywords
Nanoelectromechanical switch, NEM computing, NEM memory, heterogeneous 3-D integration
National Category
Computer Engineering
Identifiers
urn:nbn:se:kth:diva-382522 (URN)10.1109/led.2026.3655495 (DOI)001716040600017 ()2-s2.0-105028225315 (Scopus ID)
Note
QC 20260527
2026-05-272026-05-272026-05-28Bibliographically approved