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2025 (English) In: 31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025 - Proceedings, Institute of Electrical and Electronics Engineers (IEEE) , 2025Conference paper, Published paper (Refereed)
Abstract [en] We report lower experimental values of thermal contact resistance between TO-247 package and aluminum heat sink compared to calculated values, achieved by introduction of an ultra-thin interlayer silver film. In the calculation of thermal contact resistance, we have also analyzed the effect of air pressure inside the microscopic voids within the interface. The probable explanation of the lowered thermal contact resistance is a mechanical pressure dependent softening of the ultra-thin films, filling out microscopic voids.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE), 2025
Keywords TIM, TO 247, component, electronics cooling, power package, thermal conductance, thermal contact resistance, thermal interface material
National Category
Power Systems and Components
Identifiers urn:nbn:se:kth:diva-385513 (URN) 10.1109/THERMINIC65879.2025.11216892 (DOI) 2-s2.0-105023641410 (Scopus ID)
Conference 31st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2025, Naples, Italy, September 24-26, 2025
Note Part of ISBN 9798331594862
QC 20260715
2026-07-152026-07-152026-07-15 Bibliographically approved