Open this publication in new window or tab >>Show others...
2026 (English)In: International journal of plasticity, ISSN 0749-6419, E-ISSN 1879-2154, Vol. 201, article id 104682Article in journal (Refereed) Published
Abstract [en]
Laser additive manufacturing involves intrinsic rapid solidification rate and elemental segregation, which induce thermal residual stress and metastable microstructures, potentially leading to mechanical performance degradation. To address this, we tailored stacking fault energy (SFE) and hierarchical precipitation to enable near-full recrystallization in a Ni-based multi-principal element alloy. Guided by phase diagram calculation and density functional theory, a Ni-Cr-Fe-Co matrix with Al/Ti/V additions was designed and fabricated to stabilize a medium-level intrinsic SFE while forming hierarchical precipitates (primary BCC/B2 and secondary nanoscale acicular phases) via direct energy deposition in-situ alloying. Uniformly distributed precipitates nucleate preferentially within the grains, with limited formation at the boundaries. This microstructural change further promotes dynamic recrystallization under inherent severe plastic deformation. Consequently, the as-deposited alloy developed ∼92% recrystallized grains and exhibited a yield strength of 790 MPa, ultimate tensile strength of 1164 MPa, and uniform elongation of 24.6%, while multiscale characterizations confirmed plastic deformation interaction of precipitation within the recrystallized grains. This study demonstrates that engineering SFE and hierarchical precipitations promote dynamic recrystallization and synergetic mechanical properties, offering a generalizable strategy for additively manufactured Ni-based alloys.
Place, publisher, year, edition, pages
Elsevier BV, 2026
Keywords
Additive manufacturing induced cellular precipitates, In situ alloying, Near-fully recrystallization, Ni-based multi-principal-element alloy, Synergetic mechanical properties
National Category
Metallurgy and Metallic Materials Manufacturing, Surface and Joining Technology
Identifiers
urn:nbn:se:kth:diva-380078 (URN)10.1016/j.ijplas.2026.104682 (DOI)001731302200001 ()2-s2.0-105033685074 (Scopus ID)
Note
QC 20260421
2026-04-212026-04-212026-04-23Bibliographically approved