A Condition Monitoring Scheme for Semiconductor Devices in Modular Multilevel Converters with Cascaded H-Bridge Submodules
2022 (English)In: 24th European Conference on Power Electronics and Applications, EPE 2022 ECCE Europe, Institute of Electrical and Electronics Engineers Inc. , 2022Conference paper, Published paper (Refereed)
Abstract [en]
In this paper, a novel online semiconductor device monitoring scheme is presented. The condition monitoring (CM) scheme is based on measuring the ON-state voltage drop of semiconductor devices, and tracking the changes in their ON-state resistance. The proposed solution measures the ON-state voltage of semiconductor devices at a controlled and readily measurable temperature. This allows for accurate CM of semiconductors as it decouples temperature related and degradation related changes in the ON-state voltage. The temperature decoupling is achieved using natural switching redundancies available to modular multilevel converter systems. Hence, the proposed CM scheme does not interfere with the output voltages and currents generated by the converter.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2022.
Keywords [en]
Cascaded H-Bridge, Condition monitoring, Degradation, Device characterisation, Diagnostics, Estimation technique, FACTS, Modular Multilevel Converters (MMC), Reliability, Semiconductor device, Thermal model, Bridge circuits, Flexible AC transmission systems, Power electronics, Semiconductor devices, Condition, Device characterization, Diagnostic, Estimation techniques, Modular multilevel converter, Modulars, Multilevel converter, Submodules, Power converters
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-328927ISI: 000886231601011Scopus ID: 2-s2.0-85141549397OAI: oai:DiVA.org:kth-328927DiVA, id: diva2:1766969
Conference
24th European Conference on Power Electronics and Applications, EPE 2022 ECCE Europe, 5-9 September 2022
Note
QC 20230613
2023-06-132023-06-132025-01-21Bibliographically approved