In this study, a novel method using Focus Ion Beam (FIB) technique was applied to scale down Si1-xGex wires (x=0.27-0.57) to 20 nm width. Originally, the wires were processed by using Iline lithography and dry etching of SiGe on oxide (SGOI) substrates. The SGOI wafers were processed through condensation method where a SiGe/Si layer was grown in the beginning on SOI wafers and oxidized at 850-1050 °C. The shape of the nanowires (NWs) during the successive FIB cutting was examined by scanning electron microscopy (SEM) and the carrier transport through the NWs was checked by resistivity measurements. The contact resistance was reduced by Ni-silicide prior to metallization. The fabricated NWs were also suspended by tilting FIB. The results present the limitations and challenges of FIB technique to create NWs for advanced sensors and transistors.