X-ray ptychography provides the highest resolution non-destructive imaging at synchrotron radiation facilities, and the efficiency of this method is crucial for coping with limited experimental time. Recent advancements in multi-beam ptychography have enabled larger fields of view, but spatial resolution for large 3D samples remains constrained by their thickness, requiring consideration of multiple scattering events. Although this challenge has been addressed using multi-slicing in conventional ptychography, the integration of multi-slicing with multi-beam ptychography has not yet been explored. Here we present the first successful combination of these two methods, enabling high-resolution imaging of nanofeatures at depths comparable to the lateral dimensions that can be addressed by state-of-the-art multi-beam ptychography. Our approach is robust, reproducible across different beamlines, and ready for broader application. It marks a significant advancement in the field, establishing a new foundation for high-resolution 3D imaging of larger, thicker samples.