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Preparation of Surface Modified Ceria Nanoparticles as Abrasives for the Application of Chemical Mechanical Polishing (CMP)
Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China.;Beijing Inst Technol, Sch Mech Engn, Laser Micro Nano Fabricat Lab, Beijing 100081, Peoples R China..
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering, Applied Material Physics.ORCID iD: 0000-0003-4165-6690
Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China..
2020 (English)In: ECS Journal of Solid State Science and Technology, ISSN 2162-8769, E-ISSN 2162-8777, Vol. 9, no 2, article id 024015Article in journal (Refereed) Published
Abstract [en]

In this study, a method to improve the chemical mechanical polishing (CMP) performance of ceria as abrasive particles was proposed. Surface doping of ceria nanoparticles was realized by incipient impregnation method, in order to improve its valance change properties (Ce3+/Ce4+). This study presents detailed characterization of the lanthanide-doped CeO2 by both experimental methods and density functional theory (DFT) calculation. The dispersion stability of the doped ceria nanoparticles in CMP slurries are investigated. Results show that the doped CeO2 nanoparticles exhibit more oxygen vacancies and higher content of Ce3+ compared with the pristine CeO2. Good dispersion stability of the doped CeO2 nanoparticles could be achieved by adding dispersants in the CMP slurries.

Place, publisher, year, edition, pages
ELECTROCHEMICAL SOC INC , 2020. Vol. 9, no 2, article id 024015
National Category
Chemical Sciences
Identifiers
URN: urn:nbn:se:kth:diva-276928DOI: 10.1149/2162-8777/ab7098ISI: 000537386700001Scopus ID: 2-s2.0-85081081878OAI: oai:DiVA.org:kth-276928DiVA, id: diva2:1444445
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QC 20200622

Available from: 2020-06-22 Created: 2020-06-22 Last updated: 2022-06-26Bibliographically approved

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Huang, Shuo

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