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Multifunctional Materials Strategies for Enhanced Safety of Wireless, Skin-Interfaced Bioelectronic Devices
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA; Advanced Materials Division, Korea Research Institute of Chemical Technology, Yuseong-gu, Daejeon, 34114, Republic of Korea, Yuseong-gu.
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2023 (English)In: Advanced Functional Materials, ISSN 1616-301X, E-ISSN 1616-3028, Vol. 33, no 34, article id 2302256Article in journal (Refereed) Published
Abstract [en]

Many recently developed classes of wireless, skin-interfaced bioelectronic devices rely on conventional thermoset silicone elastomer materials, such as poly(dimethylsiloxane) (PDMS), as soft encapsulating structures around collections of electronic components, radio frequency antennas and, commonly, rechargeable batteries. In optimized layouts and device designs, these materials provide attractive features, most prominently in their gentle, noninvasive interfaces to the skin even at regions of high curvature and large natural deformations. Past studies, however, overlook opportunities for developing variants of these materials for multimodal means to enhance the safety of the devices against failure modes that range from mechanical damage to thermal runaway. This study presents a self-healing PDMS dynamic covalent matrix embedded with chemistries that provide thermochromism, mechanochromism, strain-adaptive stiffening, and thermal insulation, as a collection of attributes relevant to safety. Demonstrations of this materials system and associated encapsulation strategy involve a wireless, skin-interfaced device that captures mechanoacoustic signatures of health status. The concepts introduced here can apply immediately to many other related bioelectronic devices.

Place, publisher, year, edition, pages
Wiley , 2023. Vol. 33, no 34, article id 2302256
Keywords [en]
composite materials, safety, soft electronics, stimuli-responsive, wireless wearables
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:kth:diva-338453DOI: 10.1002/adfm.202302256ISI: 000985249400001Scopus ID: 2-s2.0-85159090454OAI: oai:DiVA.org:kth-338453DiVA, id: diva2:1812597
Note

QC 20231116

Available from: 2023-11-16 Created: 2023-11-16 Last updated: 2023-11-16Bibliographically approved

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Nuzzo, Ralph G.

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