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Is Your Chip Leaking Secrets via RF Signals?
KTH, School of Electrical Engineering and Computer Science (EECS), Electrical Engineering, Electronics and Embedded systems.ORCID iD: 0000-0002-4973-7412
KTH, School of Electrical Engineering and Computer Science (EECS), Electrical Engineering, Electronics and Embedded systems.ORCID iD: 0000-0001-7382-9408
KTH, School of Electrical Engineering and Computer Science (EECS), Electrical Engineering, Electronics and Embedded systems.ORCID iD: 0000-0001-6281-4091
2025 (English)In: Proceedings - 2025 IEEE 55th International Symposium on Multiple-Valued Logic, ISMVL 2025, Institute of Electrical and Electronics Engineers (IEEE) , 2025, p. 141-146Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, we present a side-channel attack on the hardware AES accelerator of a Bluetooth chip used in millions of devices worldwide, ranging from wearables and smart home products to industrial IoT. The attack leverages information about AES computations unintentionally transmitted by the chip together with RF signals to recover the encryption key. Unlike traditional side-channel attacks that rely on power or near-field electromagnetic emissions as sources of information, RF-based attacks leave no evidence of tampering, as they do not require package removal, chip decapsulation, or additional soldered components. However, side-channel emissions extracted from RF signals are considerably weaker and noisier, necessitating more traces for key recovery. The presented profiled machine learning-assisted attack can recover the full encryption key from 45,000 traces captured at a one-meter distance from the target device, with each trace being an average of 10,000 samples per encryption. This is a fourfold improvement over the correlation analysis-based attack on the same AES accelerator.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE) , 2025. p. 141-146
National Category
Computer Sciences
Identifiers
URN: urn:nbn:se:kth:diva-368821DOI: 10.1109/ISMVL64713.2025.00035ISI: 001540510800027Scopus ID: 2-s2.0-105009322477OAI: oai:DiVA.org:kth-368821DiVA, id: diva2:1994362
Conference
55th IEEE International Symposium on Multiple-Valued Logic, ISMVL 2025, Montreal, Canada, Jun 5 2025 - Jun 6 2025
Note

Part of ISBN 9798331507442

QC 20250902

Available from: 2025-09-02 Created: 2025-09-02 Last updated: 2025-12-08Bibliographically approved

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Ji, YanningDubrova, ElenaWang, Ruize

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Total: 29 hits
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