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Qualities of Physical, Everyday, Interactive Things: an Exploration of Keys
KTH, School of Electrical Engineering and Computer Science (EECS), Media Technology and Interaction Design.ORCID iD: 0009-0008-3096-4472
KTH, School of Electrical Engineering and Computer Science (EECS), Media Technology and Interaction Design.ORCID iD: 0000-0002-5309-056X
Chalmers University of Technology Gothenburg, Sweden.
University of St.Gallen St.Gallen, Switzerland.
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2026 (English)In: TEI 2026 - Proceedings of 20th International Conference on Tangible, Embedded, and Embodied Interaction, Association for Computing Machinery (ACM) , 2026, article id 55Conference paper, Published paper (Refereed)
Abstract [en]

Daily interactions with things are becoming increasingly virtual and hidden, tucked away in minimalist UI’s or dependent on clear voice commands. Motivated by a love for physical interactions, this work uses keys, a mundane, everyday technology, as our object of study, identifying what is being ‘designed away’ in the process of digitalization. This is achieved through a collection of found objects, material samples, and design probes. We present a visual exhibition in pictorial format, where each piece represents material qualities of physical, interactive artefacts. We conclude by discussing how the embodied qualities of these artifacts can be extended to the broader landscape of everyday physical things. Our work contributes to the TEI community through both the tangible artifacts and the identified qualities for designing future physical, everyday, interactive things.

Place, publisher, year, edition, pages
Association for Computing Machinery (ACM) , 2026. article id 55
Keywords [en]
collection, craft, fabrication, interaction design, Key, research through design, tangible interaction
National Category
Design Human Computer Interaction Information Systems, Social aspects Other Engineering and Technologies
Identifiers
URN: urn:nbn:se:kth:diva-382401DOI: 10.1145/3731459.3774488Scopus ID: 2-s2.0-105037884424OAI: oai:DiVA.org:kth-382401DiVA, id: diva2:2063946
Conference
20th International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2026, Hybrid, Chicago, United States of America, Mar 8 2026 - Mar 11 2026
Note

Part of ISBN 9798400718687

QC 20260601

Available from: 2026-06-01 Created: 2026-06-01 Last updated: 2026-06-01Bibliographically approved

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Lindegren, AndreasZhou, RanFernaeus, Ylva

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  • apa
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