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Stress-induced ripping enables fabrication of nanopores with dimensions smaller than the resolution limit of the employed lithography
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0001-9803-6076
KTH, School of Electrical Engineering and Computer Science (EECS), Micro and Nanosystems.ORCID iD: 0000-0003-0960-9931
division of Plasmon nanotechnology, italian institute of technology, Genova, italy.ORCID iD: 0000-0002-8710-7040
Division of Plasmon Nanotechnology, Italian Institute of Technology, Genova, Italy.ORCID iD: 0000-0002-6053-8860
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2026 (English)In: Science Advances, E-ISSN 2375-2548, Vol. 12, no 34, article id eaee8946Article in journal (Refereed) Published
Abstract [en]

Nanopores in ultrathin membranes are central to single-molecule sensing, filtration, and energy conversion applications, yet fabrication of solid-state nanopores remains limited by fundamental trade-off between resolution, throughput, and tool complexity. Here, we report a scalable nanopore fabrication process that exploits stress-induced mechanical ripping to detach a fragment from a membrane with lateral dimensions in the nm-scale, forming pores with diameters down to the sub-10 nm regime, which is well below the resolution limit of the employed lithography. Using this approach, we demonstrate wafer-scale fabrication of nanopores at densities exceeding 105 pores per cm2 in dielectric (HfO2), semiconducting (SiGe), and metallic (Cr) membranes, including suspended HfO2 membranes as thin as 2 nm. We demonstrate the utility of the fabricated nanopores for high-performance surface enhanced Raman readouts of single molecule translocations. Beyond nanopore fabrication, this fracture-based approach points to broader opportunities for nanometer- and atomic-scale structuring of ultrathin materials.

Place, publisher, year, edition, pages
American Association for the Advancement of Science (AAAS) , 2026. Vol. 12, no 34, article id eaee8946
National Category
Condensed Matter Physics Manufacturing, Surface and Joining Technology
Identifiers
URN: urn:nbn:se:kth:diva-388019DOI: 10.1126/sciadv.aee8946ISI: 001854893900015PubMedID: 42627917Scopus ID: 2-s2.0-105047889517OAI: oai:DiVA.org:kth-388019DiVA, id: diva2:2100185
Note

QC 20260910

Available from: 2026-09-10 Created: 2026-09-10 Last updated: 2026-10-08Bibliographically approved
In thesis
1. Conformal thin-film patterning via crack engineering
Open this publication in new window or tab >>Conformal thin-film patterning via crack engineering
2026 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Many nanoscale devices depend on precisely patterned features.Conventional nanofabrication methods often define these featuresdirectly, imposing a trade-off between resolution, throughput, andcost. Crack-defined patterning offers an alternative: lithographyneed not define the final nanoscale feature itself, but can instead program a mechanical instability that creates it. Established crack-basedmethods typically load a film in its own plane, causing channel cracksto propagate laterally. This thesis develops a distinct crack-definedpatterning approach driven by out-of-plane stress. A lithographicallyplaced actuator peels the film away from the substrate, detaching andremoving material. Lithography defines the mechanical geometryand actuator location, whereas stored elastic energy and release determine the resulting feature. The approach spans zero-dimensional(0D) nanopores, one-dimensional (1D) nanoslits, and conformalpatterns on three-dimensional (3D) surfaces.The first part develops stress-induced ripping, which enablesscalable nanopore fabrication. Solid-state nanopores, mainly usedfor single-molecule sensing, need openings of a few nanometers thatare difficult to define directly at wafer scale. A pre-stressed beamdefined by i-line lithography pulls a fragment out of an ultrathinmembrane, forming sub-10 nm nanopores in parallel. Retaining thefragment as a self-aligned lid gives lidded nanopores down to 4 nm.Guided self-tearing extends this to programmed crack paths andsub-20 nm features in 0D, 1D, and curved 2D patterns.The second part extends the approach to 3D surfaces, where uniform resist coating and exposure are difficult. Scaffold-architectedlift-off (SALO) uses 3D-printed sacrificial scaffolds removed by sonication to pattern conformal films such as atomic-layer-depositedcoatings on slopes up to 90◦, while also enabling features as small as50 nm and sequential patterning of multiple materials.The final part evaluates the nanopores in devices. Rippednanopores detect DNA translocation through ionic current andprovide a SERS readout after metallization. Lidded plasmonicnanopores show an optical response that varies with pore–lid geometry. An integrated nanopore–cavity–electrode platform showstranslocation and temporary docking, but not direct molecularresidence; a fluidic memristor response is also compared with asimulated polymer-lidded concept.To summarize, these results establish a thin-film patterning strategy in which out-of-plane stress drives controlled fracture. Crackdefined patterning therefore complements lithography in applicationsthat require deterministic feature placement, sub-lithographic dimensions, nonplanar surface and large-scale parallel fabrication.

Abstract [sv]

Många nanoskaliga komponenter bygger på noggrant mönstrade strukturer. Konventionella nanofabrikationsmetoder definierar ofta dessa strukturer direkt, vilket medför en avvägning mellan upplösning, produktionstakt och kostnad. Sprickdefinierad mönstring erbjuder ett alternativ: litografi kan i stället programmera en mekanisk instabilitet som skapar nanostrukturen. Etablerade sprickmetoder belastar vanligen tunna filmer i planet, vilket driver kanalsprickor lateralt. Denna avhandling utvecklar en distinkt metod driven avspänningar ut ur planet. En litografiskt placerad aktuator skalar av filmen från substratet och avlägsnar material. Litografin definierar den mekaniska geometrin och aktuatorns position, medan elastisk energi och frigörelse bestämmer strukturen. Metoden omfattar 0Dnanoporer, 1D-nanospringor och konforma mönster på 3D-ytor. Den första delen utvecklar spänningsinducerad rivning. Nanoporer i fasta material, som främst används för detektion av enskilda molekyler, kräver öppningar på några nanometer som är svåraatt definiera direkt i skivskala. En förspänd balk, definierad medi-linjelitografi, drar ut ett fragment ur ett ultratunt membran ochbildar nanoporer under 10 nm parallellt. Lockförsedda nanoporer behåller fragmentet som ett självjusterat lock och når ner till 4 nm. Styrd självrivning utvidgar rivningen till programmerade sprickbanor och strukturer under 20 nm i 0D-, 1D- och böjda 2D-mönster. Den andra delen utvidgar metoden till 3D-ytor, där jämn resistbeläggning och exponering är svåra att uppnå. Scaffold-arkitekteradavlyftning (SALO) använder 3D-printade offerscaffolder som frigörs med ultraljud för att mönstra konforma filmer, inklusive ALDbeläggningar, på lutningar upp till 90◦, med strukturer ner till 50 nmoch flera material mönstrade i följd. Den avslutande delen utvärderar nanoporerna i komponenter. Rivna nanoporer detekterar DNA-translokation via jonström ochger, efter metallisering, SERS-avläsning. Lockförsedda plasmoniska nanoporer uppvisar en optisk respons som varierar med por- och lockgeometrin. En plattform med nanopor, självjusterad femtolitervolym och elektrod uppvisar translokation och tillfällig dockning, dock inte direkt molekylär vistelse. En fluidisk memristorrespons jämförs med ett simulerat polymerförsett koncept. Sammantaget bestäms strukturstorleken vid planär mönstring avdet mekaniska tillståndet när materialet lossnar, snarare än av exponeringsljusets våglängd: strukturer i mikrometerskala, definierade med i-line-litografi, kan generera strukturer som är två storleksordningar mindre, parallellt över en wafer. Att avlägsna material normaltmot ytan överför dessutom den upplösning som definieras av stödstrukturen till konforma filmer på icke-planära substrat. Sprickdefinierad mönstring kompletterar därmed litografi i tillämpningar som kräver deterministisk placering av strukturer, sublitografiska dimensioner och storskalig parallell tillverkning, samtidigt som variation i enskilda strukturkonturer kan tolereras.

Place, publisher, year, edition, pages
KTH Royal Institute of Technology, 2026. p. 65
Series
TRITA-EECS-AVL ; 2026:83
Keywords
Nanopore, Crack, Tearing
National Category
Nanotechnology for Material Science Nanotechnology
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-390466 (URN)978-91-8106-710-1 (ISBN)
Public defence
2026-11-05, https://kth-se.zoom.us/j/69597715413, F3, Lindstedtsvägen 26, Stockholm, 09:00 (English)
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Note

QC 20261009

Available from: 2026-10-09 Created: 2026-10-08 Last updated: 2026-10-09Bibliographically approved

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