A Dual-board Substrate Integrated Waveguide for Large Phase Delay ApplicationShow others and affiliations
2021 (English)In: 2021 PHOTONICS & ELECTROMAGNETICS RESEARCH SYMPOSIUM (PIERS 2021), IEEE , 2021, p. 180-183Conference paper, Published paper (Refereed)
Abstract [en]
A novel large phase-delay transmission line based on dual printed circuit boards (PCBs) for substrate integrated waveguide (SIW) is proposed. Rectangular slots and metallic vias are used to enhance the phase delay feature. The simulated results show the phase difference of the proposed phase-delayed SIW with dual PCBs is -577 degrees at the concerned frequency of 12 GHz. The phase-delay characteristic of proposed design has been analyzed through simulations compared with both micro-strip line and single-layer SIW which using the same definite physical length. The simulated results show that phase-delay performance of our design is far superior to that of the traditional microstrip or the single-layer SIW.
Place, publisher, year, edition, pages
IEEE , 2021. p. 180-183
National Category
Signal Processing Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-313524DOI: 10.1109/PIERS53385.2021.9695035ISI: 000795902300027Scopus ID: 2-s2.0-85126395813OAI: oai:DiVA.org:kth-313524DiVA, id: diva2:1665396
Conference
Photonics and Electromagnetics Research Symposium (PIERS), NOV 21-25, 2021, Hangzhou, PEOPLES R CHINA
Note
Part of proceedings: ISBN 978-1-7281-7247-7
QC 20220607
2022-06-072022-06-072022-06-25Bibliographically approved