Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer BondingShow others and affiliations
2021 (English)In: 2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Proceedings, Institute of Electrical and Electronics Engineers Inc. , 2021Conference paper, Published paper (Refereed)
Abstract [en]
The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS2).
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2021.
Keywords [en]
Layered semiconductors, Optical fibers, Sulfur compounds, Wafer bonding, High volume manufacturing, Photonic application, Semiconductor equipment, Stackings, Two-dimensional materials, Molybdenum compounds
National Category
Atom and Molecular Physics and Optics Other Materials Engineering
Identifiers
URN: urn:nbn:se:kth:diva-313857ISI: 000831479800049Scopus ID: 2-s2.0-85120456618OAI: oai:DiVA.org:kth-313857DiVA, id: diva2:1668264
Conference
2021 Conference on Lasers and Electro-Optics, CLEO 2021, Virtual, Online, 9-14 May 2021
Note
Part of proceedings: ISBN 978-1-943580-91-0
Not duplicate with DiVA 1665889
QC 20230206
2022-06-132022-06-132025-03-28Bibliographically approved