Heterogeneously Integrated InP Electro-Absorption Modulator for Beyond 300 Gbs Optical LinksShow others and affiliations
2025 (English)In: Journal of Lightwave Technology, ISSN 0733-8724, E-ISSN 1558-2213, Vol. 43, no 4, p. 1826-1836Article in journal (Refereed) Published
Abstract [en]
The recent AI boom requires more focus on energy-efficient and scalable optical interconnects. Silicon Photonics is enabling technology to satisfy growing demand. However, the lack of lasers and high-performance modulators hinders wide-scale adoption. Therefore, we present a heterogeneously integrated Indium Phosphide electro-absorption modulator with Silicon waveguides. We demonstrate up to 256 Gb/s on-off keying, 340 Gb/s 4-level pulse amplitude modulation, 375 Gb/s 6-level pulse amplitude modulation, and 360 Gb/s 8-level pulse amplitude modulation transmission over 500 m and 6 km of single-mode fiber with performance satisfying requirements of 6.25% overhead hard-decision forward error correction threshold of 4.5x10(-3). Additionally, we investigate the modulator at 200 Gb/s per lane scenarios, demonstrating excellent performance with a simple seven-tap feed-forward equalizer.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE) , 2025. Vol. 43, no 4, p. 1826-1836
Keywords [en]
Index Terms-200 Gb/s per lane, electro-absorption modulator, heterogeneous integration, optical interconnects, silicon photonics
National Category
Telecommunications
Identifiers
URN: urn:nbn:se:kth:diva-361094DOI: 10.1109/JLT.2025.3526822ISI: 001425865300018Scopus ID: 2-s2.0-85214878866OAI: oai:DiVA.org:kth-361094DiVA, id: diva2:1943643
Note
QC 20250311
2025-03-112025-03-112025-03-11Bibliographically approved