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Integrated Nanopore Device for Electronic Single Molecule Trapping in Femtolitre Cavities Fabricated by Self-Aligned Etching
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0001-9803-6076
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0001-6731-3886
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-2278-1368
Taiwan Semiconductor Research Institute, Taiwan.
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2025 (English)In: 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems, MEMS 2025, Institute of Electrical and Electronics Engineers (IEEE) , 2025, p. 1229-1232Conference paper, Published paper (Refereed)
Abstract [en]

Single-molecule trapping and analysis are critical in understanding biomolecular processes at an unprecedented resolution. Traditional nanopore systems often face limitations in scalability and integration with electronic components, which complicates their use in compact, high-density applications. Addressing these challenges, we introduce a novel on-chip nanopore array system integrated with a silver (Ag) electrode and self-aligned femtolitersized cavities, representing an innovative approach for electronic single-molecule trapping. Our design utilizes a wafer-scale fabrication process with a buried electrode architecture, enabling the scalable production of high-density nanopore arrays without the need for through-wafer etching. Successful DNA translocation measurements demonstrate the system's potential as a versatile platform for single-molecule trapping and reaction studies.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE) , 2025. p. 1229-1232
Keywords [en]
entropic trapping, femtoliter cavity, integrated electrode, Nanopore, single molecule
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Condensed Matter Physics
Identifiers
URN: urn:nbn:se:kth:diva-362213DOI: 10.1109/MEMS61431.2025.10917579Scopus ID: 2-s2.0-105001666086OAI: oai:DiVA.org:kth-362213DiVA, id: diva2:1951007
Conference
38th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2025, Kaohsiung, Taiwan, January 19-23, 2025
Note

Part of ISBN 9798331508890

QC 20250414

Available from: 2025-04-09 Created: 2025-04-09 Last updated: 2025-04-14Bibliographically approved

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Liu, XinxinDubois, Valentin J.Raja, Shyamprasad NatarajanStemme, GöranNiklaus, Frank

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Liu, XinxinDubois, Valentin J.Raja, Shyamprasad NatarajanStemme, GöranNiklaus, Frank
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