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High-Resolution 3D Radar Imaging with Silicon-Micromachined Sub-THz Frequency-Diverse Antennas
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems. (THz Lab)ORCID iD: 0000-0002-3050-7705
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems. (THz Lab)ORCID iD: 0000-0003-3339-9137
2025 (English)In: 2025 IEEE/MTT-S International Microwave Symposium, IMS 2025, Institute of Electrical and Electronics Engineers (IEEE) , 2025, p. 89-92Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents a sub-THz 3D computational imaging system utilizing compact wideband cavity-backed frequency-diverse antennas fabricated by silicon micromachining. The antennas are integrated with a novel two-section direct waveguide transition feed. A pair of fabricated Mills-Cross transmitter and receiver antennas, generating pseudo-random frequency-diverse patterns within an 18 cm × 18 cm scanning aperture, achieve high-resolution imaging in the 220-330 GHz frequency range, with range and cross-range resolutions of 1.36 mm and 3 mm, respectively. The image reconstruction is done with a Fast Iterative Shrinkage-Thresholding Algorithm (FISTA). The system performance is evaluated by emulated experiments using the measured radiation patterns of the frequency-diverse antennas in the forward model and investigated under various signal-to-noise conditions. The hardware/signal-processing combination performs excellently when the signal-to-noise ratio is 10 dB or better. Already, an image with a signal-to-noise ratio of 10 dB is not distinguishable from an image without noise.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE) , 2025. p. 89-92
Keywords [en]
antenna design, frequency-diverse antenna, silicon micromachining, Sub-THz imaging
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Signal Processing Telecommunications
Identifiers
URN: urn:nbn:se:kth:diva-370320DOI: 10.1109/IMS40360.2025.11103967ISI: 001555637900022Scopus ID: 2-s2.0-105014241104OAI: oai:DiVA.org:kth-370320DiVA, id: diva2:2000571
Conference
2025 IEEE/MTT-S International Microwave Symposium, IMS 2025, San Francisco, United States of America, Jun 15-20 2025
Note

Part of ISBN 9798331514099

QC 20250924

Available from: 2025-09-24 Created: 2025-09-24 Last updated: 2025-12-05Bibliographically approved

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Seidi Goldar, Mohammad RezaOberhammer, Joachim

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