Reconciling robust adhesion to glass with post-cure reprocessability remains a persistent challenge for thermoset adhesives, as interfacial strength is often gained at the expense of network reconfigurability. In this work, lignin-derived epoxy Covalent Adaptable Networks incorporating exchangeable silyl ether linkages were constructed through epoxidation of organosolv lignin followed by curing with a siloxane-containing diamine under catalytic conditions. The resulting networks exhibited improved thermal resistance and lignin-dependent thermomechanical behavior, while stress-relaxation measurements revealed efficient topology rearrangement over 150–180 °C. This dynamic character enabled hot-press reprocessing, with 86–96% retention of tensile strength after one recycling cycle. Owing to the presence of siloxane-containing segments, wetting on glass was enhanced, and the optimized formulation delivered a lap shear strength of 1.51 MPa. More importantly, fractured joints could be thermally reassembled while retaining 70–90% of their original bonding strength, demonstrating that dynamic network rearrangement could be translated into recoverable interfacial performance. Lignin also imparted an intrinsic photothermal response, enabling rapid near-infrared-induced local heating and contactless surface repair. These findings establish a recyclable thermoset adhesive platform in which renewable aromatic feedstocks, dynamic Si–O exchange, and glass-oriented interfacial design are integrated within a single network architecture.